Datasheet HMC705LP4, HMC705LP4E (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 6.5 GHz Programmable Divider (N = 1 - 17) |
| Pages / Page | 12 / 6 — HMC705LP4 / HMC705LP4E. 6.5 GHz PROGRAMMABLE DIVIDER (N = 1 - 17). … |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
HMC705LP4 / HMC705LP4E. 6.5 GHz PROGRAMMABLE DIVIDER (N = 1 - 17). Absolute Maximum Ratings. Typical Supply Current vs. Vcc
Model Line for this Datasheet
Text Version of Document
HMC705LP4 / HMC705LP4E
v04.0212
6.5 GHz PROGRAMMABLE DIVIDER (N = 1 - 17) Absolute Maximum Ratings Typical Supply Current vs. Vcc
rF input (vcc= +5v) +13 dBm vcc (v) icc (mA) supply voltage (vcc) +5.5v 4.75 180 t Logic inputs -0.5v to (0.5v + vcc) 5.00 190 M Junction temperature (tc) 135 °c 5.25 210 s continuous Pdiss (t = 85 °c) note: HMc705LP4e will work over full voltage range above. 2.4 W (derate 49 mW/° c above 85 °c) thermal resistance s - 20.5 °c/W (Junction to ground paddle) r storage temperature -65 to +150 °c eLectrostAtic sensitive Device o operating temperature -40 to +85 °c oBserve HAnDLinG PrecAutions t c e t
Outline Drawing
e s & D r e iD iv y D c n e u q notes: e 1. LeADFrAMe MAteriAL: coPPer ALLoy r 2. DiMensions Are in incHes [MiLLiMeters]. F 3. LeAD sPAcinG toLerAnce is non-cuMuLAtive 4. PAD Burr LenGtH sHALL Be 0.15mm MAXiMuM. PAD Burr HeiGHt sHALL Be 0.05mm MAXiMuM. 5. PAcKAGe WArP sHALL not eXceeD 0.05mm. 6. ALL GrounD LeADs AnD GrounD PADDLe Must Be soLDereD to PcB rF GrounD. 7. reFer to Hittite APPLicAtion note For suGGesteD
Package Information
PcB LAnD PAttern. Part number Package Body Material Lead Finish MsL rating Package Marking [3] HMc705LP4 Low stress injection Molded Plastic sn/Pb solder MsL1 [1] H705 XXXX HMc705LP4e roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] H705 XXXX [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D
v04.0212
6.5 GHz PROGRAMMABLE DIVIDER (N = 1 - 17) Absolute Maximum Ratings Typical Supply Current vs. Vcc
rF input (vcc= +5v) +13 dBm vcc (v) icc (mA) supply voltage (vcc) +5.5v 4.75 180 t Logic inputs -0.5v to (0.5v + vcc) 5.00 190 M Junction temperature (tc) 135 °c 5.25 210 s continuous Pdiss (t = 85 °c) note: HMc705LP4e will work over full voltage range above. 2.4 W (derate 49 mW/° c above 85 °c) thermal resistance s - 20.5 °c/W (Junction to ground paddle) r storage temperature -65 to +150 °c eLectrostAtic sensitive Device o operating temperature -40 to +85 °c oBserve HAnDLinG PrecAutions t c e t
Outline Drawing
e s & D r e iD iv y D c n e u q notes: e 1. LeADFrAMe MAteriAL: coPPer ALLoy r 2. DiMensions Are in incHes [MiLLiMeters]. F 3. LeAD sPAcinG toLerAnce is non-cuMuLAtive 4. PAD Burr LenGtH sHALL Be 0.15mm MAXiMuM. PAD Burr HeiGHt sHALL Be 0.05mm MAXiMuM. 5. PAcKAGe WArP sHALL not eXceeD 0.05mm. 6. ALL GrounD LeADs AnD GrounD PADDLe Must Be soLDereD to PcB rF GrounD. 7. reFer to Hittite APPLicAtion note For suGGesteD
Package Information
PcB LAnD PAttern. Part number Package Body Material Lead Finish MsL rating Package Marking [3] HMc705LP4 Low stress injection Molded Plastic sn/Pb solder MsL1 [1] H705 XXXX HMc705LP4e roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] H705 XXXX [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D
