Datasheet LTM8064 (Analog Devices) - 2

LTM8064
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
VIN, RUN ...60V TOP VIEW FB, CTRL1, CTRL2, I FB PGOOD RUN OUTMON ...3V 1 2 3 4 5 6 7 8 9 VOUT ..40V GND A MODE, SYNC, PGOOD...6V (BANK 2) BANK 1 VIN CTRL2 B Internal Operating Temperature Range .. –40°C to 125°C VREF Peak Solder Reflow Temperature .. 245°C CTRL1 C Storage Temperature.. –55°C to 125°C SS D BANK 2 IOUTMON E RT GND SYNC F MODE G H J BANK 3 K VOUT L M BGA PACKAGE 108-LEAD (16mm × 11.9mm × 4.92mm) TJMAX = 125°C, θJA = 6.9°C/W, θJCbottom = 2.2°C/W, θJCTOP = 8.1°C/W, θJB = 6.0°C/W WEIGHT = 2.44g, θ VALUES DETERMINED PER JEDEC JESD51-9, 51-12
orDer inForMaTion http://www.linear.com/product/LTM8064#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE (NOTE 2) TYPE RATING DEVICE FINISH CODE
LTM8064EY#PBF SAC305 (RoHS) LTM8064Y e1 BGA 3 –40°C to 125°C LTM8064IY#PBF SAC305 (RoHS) LTM8064Y e1 BGA 3 –40°C to 125°C LTM8064IY SnPb (63/37) LTM8064Y e0 BGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree http://www.linear.com/packaging 8064fa 2 For more information www.linear.com/LTM8064 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts