Datasheet ADP2119, ADP2120 (Analog Devices) - 5

Data Sheet ADP2119/ADP2120 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device VIN, PVIN −0.3 V to +6 V soldered in a circuit board for surface-mount packages. SW −0.3 V to +6 V
Table 3. Thermal Resistance
FB, SYNC/MODE, EN, TRK, PGOOD −0.3 V to +6 V
Package Type θ Unit JA
PGND to GND −0.3 V to +0.3 V 10-Lead LFCSP_WD 40 °C/W Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C
BOUNDARY CONDITION
Soldering Conditions JEDEC J-STD-020 θJA is measured using natural convection on a JEDEC 4-layer Stresses above those listed under Absolute Maximum Ratings board, and the exposed pad is soldered to the printed circuit may cause permanent damage to the device. This is a stress board (PCB) with thermal vias. rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute
ESD CAUTION
maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 24 Document Outline Features Applications Typical Application Circuit General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance Boundary Condition ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Functional Block Diagram Theory of Operation Control Scheme PWM Mode Operation PFM Mode Operation Slope Compensation Enable/Shutdown Integrated Soft Start Tracking Oscillator and Synchronization Current Limit and Short-Circuit Protection Overvoltage Protection (OVP) Undervoltage Lockout (UVLO) Thermal Shutdown Power Good (PGOOD) Applications Information ADIsimPower Design Tool Output Voltage Selection Inductor Selection Output Capacitor Selection Input Capacitor Selection Voltage Tracking Typical Application Circuits Outline Dimensions Ordering Guide