Datasheet ADP2108 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | Compact, 600 mA, 3 MHz, Step-Down DC-to-DC Converter |
| Pages / Page | 20 / 4 — ADP2108. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. … |
| Revision | H |
| File Format / Size | PDF / 1.1 Mb |
| Document Language | English |
ADP2108. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. THERMAL RESISTANCE. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
ADP2108 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2.
In applications with moderate power dissipation and low PCB
Parameter Rating
thermal resistance, the maximum ambient temperature can VIN, EN −0.4 V to +6.5 V exceed the maximum limit as long as the junction temperature FB, SW to GND −1.0 V to (VIN + 0.2 V) is within specification limits. The junction temperature (TJ) Operating Ambient Temperature Range −40°C to +125°C of the device is dependent on the ambient temperature (TA), Operating Junction Temperature Range −40°C to +125°C the power dissipation (PD) of the device, and the junction-to- Storage Temperature Range −65°C to +150°C ambient thermal resistance of the package (θJA). Maximum Lead Temperature Range −65°C to +150°C junction temperature (TJ) is calculated from the ambient Soldering (10 sec) 300°C temperature (TA) and power dissipation (PD) using the formula Vapor Phase (60 sec) 215°C TJ = TA + (PD × θJA). Infrared (15 sec) 220°C
THERMAL RESISTANCE
ESD Human Body Model ±1500 V ESD Charged Device Model ±500 V θJA is specified for a device mounted on a JEDEC 2S2P PCB. ESD Machine Model ±100 V
Table 3. Thermal Resistance
Stresses above those listed under Absolute Maximum Ratings
Package Type θJA Unit
may cause permanent damage to the device. This is a stress 5-Ball WLCSP 105 °C/W rating only; functional operation of the device at these or any 5-Lead TSOT 170 °C/W other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
ESD CAUTION
device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. The ADP2108 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. Rev. H | Page 4 of 20 Document Outline Features Applications General Description Typical Applications Circuit Table of Contents Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Control Scheme PWM Mode Power Save Mode Power Save Mode Current Threshold Enable/Shutdown Short-Circuit Protection Undervoltage Lockout Thermal Protection Soft Start Current Limit 100% Duty Operation Applications Information ADIsimPower Design Tool External Component Selection Inductor Output Capacitor Input Capacitor Thermal Considerations PCB Layout Guidelines Evaluation Board Outline Dimensions Ordering Guide
In applications with moderate power dissipation and low PCB
Parameter Rating
thermal resistance, the maximum ambient temperature can VIN, EN −0.4 V to +6.5 V exceed the maximum limit as long as the junction temperature FB, SW to GND −1.0 V to (VIN + 0.2 V) is within specification limits. The junction temperature (TJ) Operating Ambient Temperature Range −40°C to +125°C of the device is dependent on the ambient temperature (TA), Operating Junction Temperature Range −40°C to +125°C the power dissipation (PD) of the device, and the junction-to- Storage Temperature Range −65°C to +150°C ambient thermal resistance of the package (θJA). Maximum Lead Temperature Range −65°C to +150°C junction temperature (TJ) is calculated from the ambient Soldering (10 sec) 300°C temperature (TA) and power dissipation (PD) using the formula Vapor Phase (60 sec) 215°C TJ = TA + (PD × θJA). Infrared (15 sec) 220°C
THERMAL RESISTANCE
ESD Human Body Model ±1500 V ESD Charged Device Model ±500 V θJA is specified for a device mounted on a JEDEC 2S2P PCB. ESD Machine Model ±100 V
Table 3. Thermal Resistance
Stresses above those listed under Absolute Maximum Ratings
Package Type θJA Unit
may cause permanent damage to the device. This is a stress 5-Ball WLCSP 105 °C/W rating only; functional operation of the device at these or any 5-Lead TSOT 170 °C/W other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
ESD CAUTION
device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. The ADP2108 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. Rev. H | Page 4 of 20 Document Outline Features Applications General Description Typical Applications Circuit Table of Contents Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Control Scheme PWM Mode Power Save Mode Power Save Mode Current Threshold Enable/Shutdown Short-Circuit Protection Undervoltage Lockout Thermal Protection Soft Start Current Limit 100% Duty Operation Applications Information ADIsimPower Design Tool External Component Selection Inductor Output Capacitor Input Capacitor Thermal Considerations PCB Layout Guidelines Evaluation Board Outline Dimensions Ordering Guide
