Datasheet HMC313, 313E (Analog Devices) - 4

HMC313 / 313E
v07.0418
GaAs InGaP HBT MMIC BROADBAND AMPLIFIER GAIN BLOCK, DC - 6 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Vdc RF Input Power (RFIN)(Vcc = +5Vdc) +20 dBm ELECTROSTATIC SENSITIVE DEVICE Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS Continuous Pdiss (T = 85
°
C) 0.259 W T (derate 3.99 mW/
°
C above 85
°
C) M Thermal Resistance (junction to pin 2 lead) [1] 251 °C/W S Storage Temperature -65 to +150 °C S - Operating Temperature -40 to +85 °C R ESD Sensitivity (HBM) Class 1A IE [1] Pin 2 REQUIRES good thermal attachment to the PCB
6-Lead Small Outline Transistor Package [SOT-23]
LIF
Outline Drawing (RJ-6) Dimensions shown in millimeters
P M
3.00 2.90 2.80
K A C
6 5 4 3.00 1.70 2.80 1.60
LO
2.60 1.50 1 2 3 PIN 1 INDICATOR 0.95 BSC
IN B
1.90
A
BSC
G
1.30 1.15 0.90 1.45 MAX 0.20 MAX 0.08 MIN
R &
0.95 MIN 0.55
E
0.15 MAX 10° SEATING 0.45 0.05 MIN 0.50 MAX 4° 0.60 0.35
IV
PLANE 0.30 MIN 0° BSC
R D
COMPLIANT TO JEDEC STANDARDS MO-178-AB 12-16-2008-A
6-Lead Small Outline Transistor Package [SOT-23] (RJ-6) Dimensions shown in mil imeters.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC313 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H313 XXXX HMC313TR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 313 XXXX HMC313E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 313E XXXX HMC313ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 313E XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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