Datasheet DPS368 (Infineon) - 5

ManufacturerInfineon
DescriptionXENSIV™ DPS368 - ultra small waterproof pressure sensor, environmentally protected against water (IPx8), dust & humidity
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DPS368. Definitions, acronyms and abbreviations. 1.1. Definitions. Table 1 Term. Definition/explanation. measurement rate

DPS368 Definitions, acronyms and abbreviations 1.1 Definitions Table 1 Term Definition/explanation measurement rate

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DPS368 Definitions, acronyms and abbreviations 1 Definitions, acronyms and abbreviations 1.1 Definitions
An explanation of terms and definitions used in this datasheet.
Table 1 Term Definition/explanation
Absolute accuracy The absolute measurement accuracy over the entire measurement range. Digital bit depth The total bit depth used for conversion of the sensor input to the digital output. Measured in bits. Digital resolution The pressure value represented by the LSB change in output. This value should be much smaller than the sensor noise. Full Scale Range (FSR) The peak-to-peak measurement range of the sensor. LSB Least Significant Bit Measurement time The time required to acquire one sensor output result. This value determines the maximum
measurement rate
. MSB Most Significant Bit Non-linearity The deviation of measured output from the best-fit straight line, relative to 1000 hPa and 25 °C. Output compensation The process of applying an algorithm to the sensor output to improve the absolute accuracy of the sensor across temperature and to minimize unit to unit output variation. This algorithm makes use of both the temperature sensor readings and the individual calibration coefficients. Precision (noise) The smallest measurable change, expressed as rms, after sensor oversampling. Pressure temperature coefficient The pressure measurement deviation, after compensation, from expected measurement value due to temperature change from 25 °C. Measured in Pa/K. Sensor calibration The process, during the production test, where the sensor's measurement results are compared against reference values, and a set of calibration coefficients are calculated from the deviation. The coefficients are stored in the sensor's memory and are used in the output compensation. Sensor oversampling rate (OSR) Specifies the number of sensor measurements used internally to generate one sensor output result. Preliminary datasheet 5 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer