Datasheet AD7981-KGD (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | High Temperature, 16-Bit, 600 kSPS PulSAR ADC |
| Pages / Page | 9 / 9 — Known Good Die. AD7981-KGD. OUTLINE DIMENSIONS. 1.520. 0.750. 1 2. 2.285. … |
| Revision | A |
| File Format / Size | PDF / 253 Kb |
| Document Language | English |
Known Good Die. AD7981-KGD. OUTLINE DIMENSIONS. 1.520. 0.750. 1 2. 2.285. 5 5. 7 6. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 2014-. 0.07 × 0.07
Model Line for this Datasheet
Text Version of Document
Known Good Die AD7981-KGD OUTLINE DIMENSIONS 1.520 0.750 1 10 1 2 2 10 2.285 3 9 4 8 5 5 7 6 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 2014- 0.07 × 0.07 01- 12-
Figure 5. 10-Pad Bare Die [CHIP] (C-10-5) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1440 × 2205 µm Scribe Line Width 80 × 80 µm Die Size 1520 × 2285 µm Thickness 750 µm Bond Pad 70 × 70 µm Bond Pad Composition 0.5 AlCu % Backside Standard assembly die attach Not applicable Passivation Oxynitride Not applicable
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball1 or aluminum wedge Bonding Sequence Bond pin five first 1 Evaluate the gold wire for suitability before use at elevated temperatures for extended durations.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7981-KGD-WP −55°C to +175°C 10-Pad Bare Die [CHIP] C-10-5
©2015–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12589-0-10/17(A)
Rev. A | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 5. 10-Pad Bare Die [CHIP] (C-10-5) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1440 × 2205 µm Scribe Line Width 80 × 80 µm Die Size 1520 × 2285 µm Thickness 750 µm Bond Pad 70 × 70 µm Bond Pad Composition 0.5 AlCu % Backside Standard assembly die attach Not applicable Passivation Oxynitride Not applicable
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball1 or aluminum wedge Bonding Sequence Bond pin five first 1 Evaluate the gold wire for suitability before use at elevated temperatures for extended durations.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7981-KGD-WP −55°C to +175°C 10-Pad Bare Die [CHIP] C-10-5
©2015–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12589-0-10/17(A)
Rev. A | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
