Datasheet BC846S (NXP) - 5
| Manufacturer | NXP |
| Description | NPN general purpose double transistor 65 V, 100 mA, SOT363 |
| Pages / Page | 7 / 5 — PACKAGE OUTLINE. Plastic surface mounted package; 6 leads. SOT363. … |
| File Format / Size | PDF / 206 Kb |
| Document Language | English |
PACKAGE OUTLINE. Plastic surface mounted package; 6 leads. SOT363. DIMENSIONS (mm are the original dimensions). UNIT. max
Model Line for this Datasheet
Text Version of Document
NXP Semiconductors Product data sheet NPN general purpose double transistor BC846S
PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT363
D B E A X y HE v M A
6 5 4
Q pin 1 index A A1
1 2 3
c e1 b w M B p Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v w max 1 HE Lp Q y
1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25 mm 0.1 1.3 0.65 0.2 0.2 0.1 0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT363 SC-88 97-02-28 1999 Sep 01 5 Document Outline Features Applications Description Pinning Marking Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT363
D B E A X y HE v M A
6 5 4
Q pin 1 index A A1
1 2 3
c e1 b w M B p Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v w max 1 HE Lp Q y
1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25 mm 0.1 1.3 0.65 0.2 0.2 0.1 0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT363 SC-88 97-02-28 1999 Sep 01 5 Document Outline Features Applications Description Pinning Marking Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
