Datasheet AL5814Q (Diodes) - 4
| Manufacturer | Diodes |
| Description | Automotive Compliant 60V LED Linear Dimmable LED Controller |
| Pages / Page | 14 / 4 — AL5814Q. ESD Ratings. Symbol. Parameter. Rating. Unit. Recommended … |
| File Format / Size | PDF / 561 Kb |
| Document Language | English |
AL5814Q. ESD Ratings. Symbol. Parameter. Rating. Unit. Recommended Operating Conditions. Min. Max. OD R. Thermal Information. www.diodes.com
Model Line for this Datasheet
Text Version of Document
AL5814Q ESD Ratings Symbol Parameter Rating Unit
Human-Body Model (HMB), Per AEC Q100-002 (Note 6) ±2000 VESD Other Pins ±500 V Charged-Device Model (CDM), per AEC Q100-011 Corner Pins (1, 4, 5, 8,) ±750 Note: 6. AEC-Q100-002 indicates that HBM stressing shall be accordance with the ANSI/ESDA/JEDEC JS-001 specification
T Recommended Operating Conditions UC Symbol Parameter Min Max Unit
VVCC Supply Voltage Range Relative to GND Pin 4.5 60 V
OD R
VOUT OUT Voltage Range (Note 7) 0 3 V
P
IOUT OUT Pin Current (Note 7) 0 15 mA
W
VVSET VSET Pin Operating Input Voltage Range 0 0.6 V
E
TA Operating Ambient Temperature -40 +125 °C
N
Note: 7. The maximum source current and drive voltage out of the OUT pin is limited by an internal clamp as well as maximum recommended junction temperature not exceeding 150°C. OUT voltages greater than 3V are supported but at reduced output currents. As VCC reduces below 6V the maximum output voltage supporting output currents above 10mA also reduces; VCC-VOUT ≥ 3V.
Thermal Information
(Note 8)
Symbol Parameter Rating Unit
ϴJA Junction-To-Ambient Thermal Resistance 56 °C/W ϴJC Junction-To-Case (Top) Thermal Resistance 8 °C/W Note: 8. Device mounted on FR-4 PCB (51mm × 51mm 2oz copper); minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is required. AL5814Q 4 of 14 April 2019 Document number: DS41792 Rev. 1 - 2
www.diodes.com
© Diodes Incorporated Document Outline Pin Assignments Description Applications Features Package Outline Dimensions Suggested Pad Layout
Human-Body Model (HMB), Per AEC Q100-002 (Note 6) ±2000 VESD Other Pins ±500 V Charged-Device Model (CDM), per AEC Q100-011 Corner Pins (1, 4, 5, 8,) ±750 Note: 6. AEC-Q100-002 indicates that HBM stressing shall be accordance with the ANSI/ESDA/JEDEC JS-001 specification
T Recommended Operating Conditions UC Symbol Parameter Min Max Unit
VVCC Supply Voltage Range Relative to GND Pin 4.5 60 V
OD R
VOUT OUT Voltage Range (Note 7) 0 3 V
P
IOUT OUT Pin Current (Note 7) 0 15 mA
W
VVSET VSET Pin Operating Input Voltage Range 0 0.6 V
E
TA Operating Ambient Temperature -40 +125 °C
N
Note: 7. The maximum source current and drive voltage out of the OUT pin is limited by an internal clamp as well as maximum recommended junction temperature not exceeding 150°C. OUT voltages greater than 3V are supported but at reduced output currents. As VCC reduces below 6V the maximum output voltage supporting output currents above 10mA also reduces; VCC-VOUT ≥ 3V.
Thermal Information
(Note 8)
Symbol Parameter Rating Unit
ϴJA Junction-To-Ambient Thermal Resistance 56 °C/W ϴJC Junction-To-Case (Top) Thermal Resistance 8 °C/W Note: 8. Device mounted on FR-4 PCB (51mm × 51mm 2oz copper); minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is required. AL5814Q 4 of 14 April 2019 Document number: DS41792 Rev. 1 - 2
www.diodes.com
© Diodes Incorporated Document Outline Pin Assignments Description Applications Features Package Outline Dimensions Suggested Pad Layout
