Datasheet LT3462, LT3462A (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | Inverting 1.2MHz/2.7MHz DC/DC Converters with Integrated Schottky |
| Pages / Page | 12 / 9 — PACKAGE DESCRIPTION. Please refer to … |
| Revision | A |
| File Format / Size | PDF / 480 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/product/LT3462#packaging for the most recent package drawings
Model Line for this Datasheet
Text Version of Document
LT3462/LT3462A
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT3462#packaging for the most recent package drawings. DC8 Package 8-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1719 Rev A) 0.70 ±0.05 2.55 ±0.05 0.64 ±0.05 1.15 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.45 BSC 1.37 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP R = 0.05 5 8 TYP 0.40 ±0.10 2.00 ±0.10 0.64 ±0.10 PIN 1 NOTCH (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 × 45° (SEE NOTE 6) CHAMFER (DC8) DFN 0409 REVA 4 1 0.23 ±0.05 0.200 REF 0.75 ±0.05 0.45 BSC 1.37 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev A For more information www.analog.com 9 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT3462#packaging for the most recent package drawings. DC8 Package 8-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1719 Rev A) 0.70 ±0.05 2.55 ±0.05 0.64 ±0.05 1.15 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.45 BSC 1.37 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP R = 0.05 5 8 TYP 0.40 ±0.10 2.00 ±0.10 0.64 ±0.10 PIN 1 NOTCH (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 × 45° (SEE NOTE 6) CHAMFER (DC8) DFN 0409 REVA 4 1 0.23 ±0.05 0.200 REF 0.75 ±0.05 0.45 BSC 1.37 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev A For more information www.analog.com 9 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
