Datasheet LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302 (ON Semiconductor) - 10

LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302 PACKAGE DIMENSIONS TSSOP−14
CASE 948G ISSUE B
14X REF K
NOTES: 1. DIMENSIONING AND TOLERANCING PER 0.10 (0.004) M T U S V S ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT
N
EXCEED 0.15 (0.006) PER SIDE. 0.25 (0.010)
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4. DIMENSION B DOES NOT INCLUDE
2X L/2
INTERLEAD FLASH OR PROTRUSION.
M
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
B
5. DIMENSION K DOES NOT INCLUDE DAMBAR
L
PROTRUSION. ALLOWABLE DAMBAR
−U− N PIN 1
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IDENT. F
IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 7
6. TERMINAL NUMBERS ARE SHOWN FOR
DETAIL E
REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. 0.15 (0.006) T U S
K A MILLIMETERS INCHES K1 DIM MIN MAX MIN MAX −V− A
4.90 5.10 0.193 0.200 ÇÇÇ ÉÉÉ
B
4.30 4.50 0.169 0.177
J J1 C
−−− 1.20 −−− 0.047 ÇÇÇ ÉÉÉ
D
0.05 0.15 0.002 0.006
F
0.50 0.75 0.020 0.030
SECTION N−
ÉÉÉ
N
ÇÇÇ
G
0.65 BSC 0.026 BSC
H
0.50 0.60 0.020 0.024
J
0.09 0.20 0.004 0.008
J1
0.09 0.16 0.004 0.006
−W− C K
0.19 0.30 0.007 0.012
K1
0.19 0.25 0.007 0.010
L
6.40 BSC 0.252 BSC 0.10 (0.004)
M
0 _ 8 _ 0 _ 8 _
−T− SEATING D G H DETAIL E PLANE SOLDERING FOOTPRINT
7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS
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