Datasheet ICM7555 (NXP) - 6
| Manufacturer | NXP |
| Description | General purpose CMOS timer |
| Pages / Page | 22 / 6 — NXP Semiconductors. ICM7555. General purpose CMOS timer. 10. Typical … |
| File Format / Size | PDF / 125 Kb |
| Document Language | English |
NXP Semiconductors. ICM7555. General purpose CMOS timer. 10. Typical performance curves. Fig 4
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ICM7555
Text Version of Document
NXP Semiconductors ICM7555 General purpose CMOS timer 10. Typical performance curves
002aae404 250 IDD (µA) 200 Tamb = −55 °C +25 °C 150 +125 °C 100 50 0 0 5 10 15 20 VDD (V)
Fig 4. Supply current versus supply voltage
002aae405 102 Io(source) VDD = 18 V (mA) 5 V 2 V 10 1 10−1 10−1 1 102 10 VDD − VO (V) Tamb = +25 °C.
Fig 5. High output voltage drop versus output source current
002aae406 102 IDIS (mA) 10 V 1 DD = 18 V 5 V 2 V 10−1 10−1 1 10 VDIS (V) Tamb = +25 °C.
Fig 6. Discharge low output voltage versus discharge sink current
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 6 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents
002aae404 250 IDD (µA) 200 Tamb = −55 °C +25 °C 150 +125 °C 100 50 0 0 5 10 15 20 VDD (V)
Fig 4. Supply current versus supply voltage
002aae405 102 Io(source) VDD = 18 V (mA) 5 V 2 V 10 1 10−1 10−1 1 102 10 VDD − VO (V) Tamb = +25 °C.
Fig 5. High output voltage drop versus output source current
002aae406 102 IDIS (mA) 10 V 1 DD = 18 V 5 V 2 V 10−1 10−1 1 10 VDIS (V) Tamb = +25 °C.
Fig 6. Discharge low output voltage versus discharge sink current
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 6 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents
