Datasheet HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211 (Avago Technologies) - 8
| Manufacturer | Avago Technologies |
| Description | Very High CMR, Wide VCC Logic Gate Optocouplers |
| Pages / Page | 22 / 8 — HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, … |
| File Format / Size | PDF / 943 Kb |
| Document Language | English |
HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211
Model Line for this Datasheet
- HCPL-0201 HCPL-0201#060 HCPL-0201#500 HCPL-0201#560 HCPL-0201-000E HCPL-0201-060E HCPL-0201-500E HCPL-0201-560E
- HCPL-0211 HCPL-0211#060 HCPL-0211#500 HCPL-0211#560 HCPL-0211-000E HCPL-0211-060E HCPL-0211-500E HCPL-0211-560E
- HCPL-2201 HCPL-2201#060 HCPL-2201#300 HCPL-2201#360 HCPL-2201#500 HCPL-2201#560 HCPL-2201-000E HCPL-2201-060E HCPL-2201-300E HCPL-2201-360E HCPL-2201-500E HCPL-2201-560E
- HCPL-2202 HCPL-2202#060 HCPL-2202#300 HCPL-2202#360 HCPL-2202#500 HCPL-2202#560 HCPL-2202-000E HCPL-2202-060E HCPL-2202-300E HCPL-2202-360E HCPL-2202-500E HCPL-2202-560E
- HCPL-2211 HCPL-2211#060 HCPL-2211#300 HCPL-2211#360 HCPL-2211#500 HCPL-2211#560 HCPL-2211-000E HCPL-2211-060E HCPL-2211-300E HCPL-2211-360E HCPL-2211-500E HCPL-2211-560E
- HCPL-2212 HCPL-2212#060 HCPL-2212#300 HCPL-2212#360 HCPL-2212#500 HCPL-2212#560 HCPL-2212-000E HCPL-2212-060E HCPL-2212-300E HCPL-2212-360E HCPL-2212-500E HCPL-2212-560E
Text Version of Document
HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211
Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers
Solder Reflow Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.
Regulatory Information
The HCPL-22XX/02XX and HCNW22XX have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-5
(Option 060 and HCNW only.)
Insulation and Safety Related Specifications 8-Pin DIP Widebody (300 Mil) SO-8 (400 Mil) Parameter Symbol Value Value Value Unit Conditions
Minimum External Air Gap L(101) 7.1 4.9 9.6 mm Measured from input terminals to output (External Clearance) terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 4.8 10.0 mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 0.08 1.0 mm Through insulation distance, conductor (Internal Clearance) to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal Tracking NA NA 4.0 mm Measured from input terminals to output (Internal Creepage) terminals, along internal cavity. Tracking Resistance CTI 200 200 200 V DIN IEC 112/VDE 0303 Part 1. (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1).
NOTE:
Option 300 - surface mount classification is Class A in accordance with CECC 00802. Broadcom AV02-0674EN 8 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics
Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers
Solder Reflow Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.
Regulatory Information
The HCPL-22XX/02XX and HCNW22XX have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-5
(Option 060 and HCNW only.)
Insulation and Safety Related Specifications 8-Pin DIP Widebody (300 Mil) SO-8 (400 Mil) Parameter Symbol Value Value Value Unit Conditions
Minimum External Air Gap L(101) 7.1 4.9 9.6 mm Measured from input terminals to output (External Clearance) terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 4.8 10.0 mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 0.08 1.0 mm Through insulation distance, conductor (Internal Clearance) to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal Tracking NA NA 4.0 mm Measured from input terminals to output (Internal Creepage) terminals, along internal cavity. Tracking Resistance CTI 200 200 200 V DIN IEC 112/VDE 0303 Part 1. (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1).
NOTE:
Option 300 - surface mount classification is Class A in accordance with CECC 00802. Broadcom AV02-0674EN 8 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics
