Datasheet NL27WZ14 (ON Semiconductor) - 10
| Manufacturer | ON Semiconductor |
| Description | Dual Inverter with Schmitt Trigger Input |
| Pages / Page | 12 / 10 — NL27WZ14. PACKAGE DIMENSIONS. TSOP−6. GAUGE. PLANE. MILLIMETERS. NOTE 5. … |
| Revision | 15 |
| File Format / Size | PDF / 190 Kb |
| Document Language | English |
NL27WZ14. PACKAGE DIMENSIONS. TSOP−6. GAUGE. PLANE. MILLIMETERS. NOTE 5. SEATING. C PLANE. DIM. MIN. NOM. MAX. DETAIL Z. RECOMMENDED
Model Line for this Datasheet
Text Version of Document
NL27WZ14 PACKAGE DIMENSIONS TSOP−6
CASE 318G−02 ISSUE V
D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
H
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6 5 4 L2
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
GAUGE
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
E1 E PLANE
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D ÉÉ AND E1 ARE DETERMINED AT DATUM H.
1 2 3
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. ÉÉ
L MILLIMETERS M NOTE 5 SEATING b C PLANE DIM MIN NOM MAX e A
0.90 1.00 1.10
DETAIL Z A1
0.01 0.06 0.10
b
0.25 0.38 0.50
c
0.10 0.18 0.26
c D
2.90 3.00 3.10
A E
2.50 2.75 3.00 0.05
E1
1.30 1.50 1.70
e
0.85 0.95 1.05
A1 L
0.20 0.40 0.60
L2
0.25 BSC
DETAIL Z M
0° − 10° STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6: PIN 1. DRAIN PIN 1. EMITTER 2 PIN 1. ENABLE PIN 1. N/C PIN 1. EMITTER 2 PIN 1. COLLECTOR 2. DRAIN 2. BASE 1 2. N/C 2. V in 2. BASE 2 2. COLLECTOR 3. GATE 3. COLLECTOR 1 3. R BOOST 3. NOT USED 3. COLLECTOR 1 3. BASE 4. SOURCE 4. EMITTER 1 4. Vz 4. GROUND 4. EMITTER 1 4. EMITTER 5. DRAIN 5. BASE 2 5. V in 5. ENABLE 5. BASE 1 5. COLLECTOR 6. DRAIN 6. COLLECTOR 2 6. V out 6. LOAD 6. COLLECTOR 2 6. COLLECTOR STYLE 7: STYLE 8: STYLE 9: STYLE 10: STYLE 11: STYLE 12: PIN 1. COLLECTOR PIN 1. Vbus PIN 1. LOW VOLTAGE GATE PIN 1. D(OUT)+ PIN 1. SOURCE 1 PIN 1. I/O 2. COLLECTOR 2. D(in) 2. DRAIN 2. GND 2. DRAIN 2 2. GROUND 3. BASE 3. D(in)+ 3. SOURCE 3. D(OUT)− 3. DRAIN 2 3. I/O 4. N/C 4. D(out)+ 4. DRAIN 4. D(IN)− 4. SOURCE 2 4. I/O 5. COLLECTOR 5. D(out) 5. DRAIN 5. VBUS 5. GATE 1 5. VCC 6. EMITTER 6. GND 6. HIGH VOLTAGE GATE 6. D(IN)+ 6. DRAIN 1/GATE 2 6. I/O STYLE 13: STYLE 14: STYLE 15: STYLE 16: STYLE 17: PIN 1. GATE 1 PIN 1. ANODE PIN 1. ANODE PIN 1. ANODE/CATHODE PIN 1. EMITTER 2. SOURCE 2 2. SOURCE 2. SOURCE 2. BASE 2. BASE 3. GATE 2 3. GATE 3. GATE 3. EMITTER 3. ANODE/CATHODE 4. DRAIN 2 4. CATHODE/DRAIN 4. DRAIN 4. COLLECTOR 4. ANODE 5. SOURCE 1 5. CATHODE/DRAIN 5. N/C 5. ANODE 5. CATHODE 6. DRAIN 1 6. CATHODE/DRAIN 6. CATHODE 6. CATHODE 6. COLLECTOR
RECOMMENDED SOLDERING FOOTPRINT*
6X 0.60 3.20 6X 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 10
CASE 318G−02 ISSUE V
D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
H
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6 5 4 L2
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
GAUGE
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
E1 E PLANE
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D ÉÉ AND E1 ARE DETERMINED AT DATUM H.
1 2 3
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. ÉÉ
L MILLIMETERS M NOTE 5 SEATING b C PLANE DIM MIN NOM MAX e A
0.90 1.00 1.10
DETAIL Z A1
0.01 0.06 0.10
b
0.25 0.38 0.50
c
0.10 0.18 0.26
c D
2.90 3.00 3.10
A E
2.50 2.75 3.00 0.05
E1
1.30 1.50 1.70
e
0.85 0.95 1.05
A1 L
0.20 0.40 0.60
L2
0.25 BSC
DETAIL Z M
0° − 10° STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6: PIN 1. DRAIN PIN 1. EMITTER 2 PIN 1. ENABLE PIN 1. N/C PIN 1. EMITTER 2 PIN 1. COLLECTOR 2. DRAIN 2. BASE 1 2. N/C 2. V in 2. BASE 2 2. COLLECTOR 3. GATE 3. COLLECTOR 1 3. R BOOST 3. NOT USED 3. COLLECTOR 1 3. BASE 4. SOURCE 4. EMITTER 1 4. Vz 4. GROUND 4. EMITTER 1 4. EMITTER 5. DRAIN 5. BASE 2 5. V in 5. ENABLE 5. BASE 1 5. COLLECTOR 6. DRAIN 6. COLLECTOR 2 6. V out 6. LOAD 6. COLLECTOR 2 6. COLLECTOR STYLE 7: STYLE 8: STYLE 9: STYLE 10: STYLE 11: STYLE 12: PIN 1. COLLECTOR PIN 1. Vbus PIN 1. LOW VOLTAGE GATE PIN 1. D(OUT)+ PIN 1. SOURCE 1 PIN 1. I/O 2. COLLECTOR 2. D(in) 2. DRAIN 2. GND 2. DRAIN 2 2. GROUND 3. BASE 3. D(in)+ 3. SOURCE 3. D(OUT)− 3. DRAIN 2 3. I/O 4. N/C 4. D(out)+ 4. DRAIN 4. D(IN)− 4. SOURCE 2 4. I/O 5. COLLECTOR 5. D(out) 5. DRAIN 5. VBUS 5. GATE 1 5. VCC 6. EMITTER 6. GND 6. HIGH VOLTAGE GATE 6. D(IN)+ 6. DRAIN 1/GATE 2 6. I/O STYLE 13: STYLE 14: STYLE 15: STYLE 16: STYLE 17: PIN 1. GATE 1 PIN 1. ANODE PIN 1. ANODE PIN 1. ANODE/CATHODE PIN 1. EMITTER 2. SOURCE 2 2. SOURCE 2. SOURCE 2. BASE 2. BASE 3. GATE 2 3. GATE 3. GATE 3. EMITTER 3. ANODE/CATHODE 4. DRAIN 2 4. CATHODE/DRAIN 4. DRAIN 4. COLLECTOR 4. ANODE 5. SOURCE 1 5. CATHODE/DRAIN 5. N/C 5. ANODE 5. CATHODE 6. DRAIN 1 6. CATHODE/DRAIN 6. CATHODE 6. CATHODE 6. COLLECTOR
RECOMMENDED SOLDERING FOOTPRINT*
6X 0.60 3.20 6X 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 10
