Datasheet ADT75 (Analog Devices) - 7

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Data Sheet ADT75 ABSOLUTE MAXIMUM RATINGS Table 4.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any V to GND –0.3 V to +7 V DD other conditions above those indicated in the operational SDA Input Voltage to GND –0.3 V to V + 0.3 V DD section of this specification is not implied. Exposure to absolute SDA Output Voltage to GND –0.3 V to V + 0.3 V DD maximum rating conditions for extended periods may affect SCL Input Voltage to GND –0.3 V to V + 0.3 V DD device reliability. OS/ALERT Output Voltage to GND –0.3 V to V + 0.3 V DD Operating Temperature Range –55°C to +150°C
1.2
Storage Temperature Range –65°C to +160°C Maximum Junction Temperature, T 150.7°C JMAX
1.0
8-Lead MSOP (RM-8) Power Dissipation1, 2 W = (T − T )/θ MAX JMAX A JA
0.8
Thermal Impedance3 θ , Junction-to-Ambient (Still Air) 205.9°C/W JA
0.6
θ , Junction-to-Case 43.74°C/W JC 8-Lead SOIC (R-8)
0.4
Power Dissipation1, 2 W = (T − T )/θ MAX JMAX A JA Thermal Impedance3
0.2 MAXIMUM POWER DISSIPATION (Watts) MAX PD = 3.4mW AT 150
°
C
θ , Junction-to-Ambient (Still Air) 157°C/W JA θ , Junction-to-Case 56°C/W
0
05326-003 JC
0 55 50 40 30 20 10 10 20 30 40 50 60 70 80 90
IR Reflow Soldering
– – – – – – 100 110 120 130 140 150 TEMPERATURE (
°
C)
Peak Temperature 220°C (0°C/5°C) Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 3°C/sec maximum
ESD CAUTION
Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 6 minutes maximum IR Reflow Soldering (Pb-Free Package) Peak Temperature 260°C (+0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 8 minutes maximum 1 Values relate to package being used on a standard 2-layer PCB. This gives a worst case θJA and θJC. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB- mounted components. Rev. B | Page 7 of 24 Document Outline Features Applications Product Highlights Functional Block Diagram Table of Contents Revision History General Description Specifications A Grade B Grade Timing Specifications and Diagram Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Circuit Information Converter Details Functional Description Temperature Data Format Temperature Conversion Formulas One-Shot Mode Fault Queue Registers Address Pointer Register Temperature Value Register Configuration Register THYST Setpoint Register TOS Setpoint Register Serial Interface Serial Bus Address Writing Data Writing to the Address Pointer Register for a Subsequent Read Writing Data to a Register Reading Data OS/Alert Output OverTemperature Modes Comparator Mode Interrupt Mode SMBus Alert Applications Information Thermal Response Time Self-Heating Effects Supply Decoupling Temperature Monitoring Outline Dimensions Ordering Guide