Datasheet ADT7316, ADT7317, ADT7318 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | ±0.5°C Accurate Digital Temperature Sensor and Quad Voltage Output 8-Bit DACs |
| Pages / Page | 44 / 5 — ADT7316/ADT7317/ADT7318. Parameter1 Min. Typ. Max. Unit. … |
| Revision | B |
| File Format / Size | PDF / 4.0 Mb |
| Document Language | English |
ADT7316/ADT7317/ADT7318. Parameter1 Min. Typ. Max. Unit. Conditions/Comments
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ADT7316/ADT7317/ADT7318 Parameter1 Min Typ Max Unit Conditions/Comments
DIGITAL OUTPUT Output High Voltage, VOH 2.4 V ISOURCE = ISINK = 200 μA. Output Low Voltage, VOL 0.4 V IOL = 3 mA. Output High Current, IOH 1 mA VOH = 5 V. Output Capacitance, COUT 50 pF INT/INT Output Saturation Voltage 0.8 V IOUT = 4 mA. I2C TIMING CHARACTERISTICS7, 8 Serial Clock Period, t1 2.5 μs Fast-mode I2C. See Figure 4. Data In Setup Time to SCL High, t2 50 ns Data Out Stable After SCL Low, t3 0 ns See Figure 4. SDA Low Setup Time to SCL Low 50 ns See Figure 4. (Start Condition), t4 SDA High Hold Time After SCL High 50 ns See Figure 4. (Stop Condition), t5 SDA and SCL Fall Time, t6 300 ns See Figure 4. SDA and SCL Rise Time, t6 3009 ns See Figure 4. SPI TIMING CHARACTERISTICS10, 11 CS to SCLK Setup Time, t1 0 ns See Figure 7. SCLK High Pulse Width, t2 50 ns See Figure 7. SCLK Low Pulse Width, t3 50 ns See Figure 7. Data Access Time After SCLK Falling 35 ns See Figure 7. Edge, t 12 4 Data Setup Time Prior to SCLK 20 ns See Figure 7. Rising Edge, t5 Data Hold Time after SCLK Rising 0 ns See Figure 7. Edge, t6 CS to SCLK Hold Time, t7 0 ns See Figure 7. CS to DOUT High Impedance, t8 40 ns See Figure 7. POWER REQUIREMENTS VDD 2.7 5.5 V VDD Settling Time 50 ms VDD settles to within 10% of its final voltage level. IDD (Normal Mode)13 3 mA VDD = 3.3 V, VIH = VDD, and VIL = GND. 2.2 3 mA VDD = 5 V, VIH = VDD , and VIL = GND. IDD (Power-Down Mode) 10 μA VDD = 3.3 V, VIH = VDD, and VIL = GND. 10 μA VDD = 5 V, VIH = VDD, and VIL = GND. Power Dissipation 10 mW VDD = 3.3 V, using normal mode. 33 μW VDD = 3.3 V, using shutdown mode. 1 See the Terminology section. 2 DC specifications tested with the outputs unloaded. 3 Linearity is tested using a reduced code range: ADT7316 (Code 115 to 4095); ADT7317 (Code 28 to 1023); ADT7318 (Code 8 to 255). 4 A round robin is the continuous sequential measurement of the following three channels: VDD, internal temperature, and external temperature. 5 Guaranteed by design and characterization, but not production tested. 6 For the amplifier output to reach its minimum voltage, the offset error must be negative. For the amplifier output to reach its maximum voltage, VREF = VDD, offset plus gain error must be positive. 7 The SDA and SCL timing is measured with the input filters turned on to meet the fast-mode I2C specification. Switching off the input filters improves the transfer rate, but has a negative effect on the EMC behavior of the part. 8 Guaranteed by design. Not tested in production. 9 The interface is also capable of handling the I2C standard mode rise time specification of 1000 ns. 10 Guaranteed by design and characterization, but not production tested. 11 All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V. 12 Measured with the load circuit of Figure 5. 13 IDD specification is valid for all DAC codes. Interface inactive. All DACs active. Load currents excluded. Rev. B | Page 5 of 44 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS FUNCTIONAL BLOCK DIAGRAM DAC AC CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER-UP CALIBRATION CONVERSION SPEED FUNCTIONAL DESCRIPTION—VOLTAGE OUTPUT DIGITAL-TO-ANALOG CONVERTERS DIGITAL-TO-ANALOG SECTION RESISTOR STRING DAC EXTERNAL REFERENCE INPUTS OUTPUT AMPLIFIER THERMAL VOLTAGE OUTPUT Negative Temperatures Positive Temperatures FUNCTIONAL DESCRIPTION—MEASUREMENT TEMPERATURE SENSOR VDD MONITORING ON-CHIP REFERENCE ROUND ROBIN MEASUREMENT SINGLE-CHANNEL MEASUREMENT TEMPERATURE MEASUREMENT METHOD Internal Temperature Measurement External Temperature Measurement TEMPERATURE VALUE FORMAT Temperature Conversion Formula INTERRUPTS REGISTERS REGISTER DESCRIPTIONS SERIAL INTERFACE SERIAL INTERFACE SELECTION I2C SERIAL INTERFACE Writing to the ADT7316/ADT7317/ADT7318 Writing to the Address Pointer Register for a Subsequent Read Writing Data to a Register Reading Data from the ADT7316/ADT7317/ADT7318 SPI SERIAL INTERFACE Write Operation Read Operation SMBUS/SPI INT/ SMBUS Alert Response LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
ADT7316/ADT7317/ADT7318 Parameter1 Min Typ Max Unit Conditions/Comments
DIGITAL OUTPUT Output High Voltage, VOH 2.4 V ISOURCE = ISINK = 200 μA. Output Low Voltage, VOL 0.4 V IOL = 3 mA. Output High Current, IOH 1 mA VOH = 5 V. Output Capacitance, COUT 50 pF INT/INT Output Saturation Voltage 0.8 V IOUT = 4 mA. I2C TIMING CHARACTERISTICS7, 8 Serial Clock Period, t1 2.5 μs Fast-mode I2C. See Figure 4. Data In Setup Time to SCL High, t2 50 ns Data Out Stable After SCL Low, t3 0 ns See Figure 4. SDA Low Setup Time to SCL Low 50 ns See Figure 4. (Start Condition), t4 SDA High Hold Time After SCL High 50 ns See Figure 4. (Stop Condition), t5 SDA and SCL Fall Time, t6 300 ns See Figure 4. SDA and SCL Rise Time, t6 3009 ns See Figure 4. SPI TIMING CHARACTERISTICS10, 11 CS to SCLK Setup Time, t1 0 ns See Figure 7. SCLK High Pulse Width, t2 50 ns See Figure 7. SCLK Low Pulse Width, t3 50 ns See Figure 7. Data Access Time After SCLK Falling 35 ns See Figure 7. Edge, t 12 4 Data Setup Time Prior to SCLK 20 ns See Figure 7. Rising Edge, t5 Data Hold Time after SCLK Rising 0 ns See Figure 7. Edge, t6 CS to SCLK Hold Time, t7 0 ns See Figure 7. CS to DOUT High Impedance, t8 40 ns See Figure 7. POWER REQUIREMENTS VDD 2.7 5.5 V VDD Settling Time 50 ms VDD settles to within 10% of its final voltage level. IDD (Normal Mode)13 3 mA VDD = 3.3 V, VIH = VDD, and VIL = GND. 2.2 3 mA VDD = 5 V, VIH = VDD , and VIL = GND. IDD (Power-Down Mode) 10 μA VDD = 3.3 V, VIH = VDD, and VIL = GND. 10 μA VDD = 5 V, VIH = VDD, and VIL = GND. Power Dissipation 10 mW VDD = 3.3 V, using normal mode. 33 μW VDD = 3.3 V, using shutdown mode. 1 See the Terminology section. 2 DC specifications tested with the outputs unloaded. 3 Linearity is tested using a reduced code range: ADT7316 (Code 115 to 4095); ADT7317 (Code 28 to 1023); ADT7318 (Code 8 to 255). 4 A round robin is the continuous sequential measurement of the following three channels: VDD, internal temperature, and external temperature. 5 Guaranteed by design and characterization, but not production tested. 6 For the amplifier output to reach its minimum voltage, the offset error must be negative. For the amplifier output to reach its maximum voltage, VREF = VDD, offset plus gain error must be positive. 7 The SDA and SCL timing is measured with the input filters turned on to meet the fast-mode I2C specification. Switching off the input filters improves the transfer rate, but has a negative effect on the EMC behavior of the part. 8 Guaranteed by design. Not tested in production. 9 The interface is also capable of handling the I2C standard mode rise time specification of 1000 ns. 10 Guaranteed by design and characterization, but not production tested. 11 All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V. 12 Measured with the load circuit of Figure 5. 13 IDD specification is valid for all DAC codes. Interface inactive. All DACs active. Load currents excluded. Rev. B | Page 5 of 44 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS FUNCTIONAL BLOCK DIAGRAM DAC AC CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER-UP CALIBRATION CONVERSION SPEED FUNCTIONAL DESCRIPTION—VOLTAGE OUTPUT DIGITAL-TO-ANALOG CONVERTERS DIGITAL-TO-ANALOG SECTION RESISTOR STRING DAC EXTERNAL REFERENCE INPUTS OUTPUT AMPLIFIER THERMAL VOLTAGE OUTPUT Negative Temperatures Positive Temperatures FUNCTIONAL DESCRIPTION—MEASUREMENT TEMPERATURE SENSOR VDD MONITORING ON-CHIP REFERENCE ROUND ROBIN MEASUREMENT SINGLE-CHANNEL MEASUREMENT TEMPERATURE MEASUREMENT METHOD Internal Temperature Measurement External Temperature Measurement TEMPERATURE VALUE FORMAT Temperature Conversion Formula INTERRUPTS REGISTERS REGISTER DESCRIPTIONS SERIAL INTERFACE SERIAL INTERFACE SELECTION I2C SERIAL INTERFACE Writing to the ADT7316/ADT7317/ADT7318 Writing to the Address Pointer Register for a Subsequent Read Writing Data to a Register Reading Data from the ADT7316/ADT7317/ADT7318 SPI SERIAL INTERFACE Write Operation Read Operation SMBUS/SPI INT/ SMBUS Alert Response LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
