Datasheet KSZ9893RNX (Microchip) - 6

KSZ9893RNX FIGURE 2-3: PACKAGE (LAND PATTERN) 64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN] Note:
For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 X2 EV 64 1 2 ØV C2 Y2 EV G1 Y1 X1 E SILK SCREEN RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.40 BSC Optional Center Pad Width X2 6.60 Optional Center Pad Length Y2 6.60 Contact Pad Spacing C1 7.90 Contact Pad Spacing C2 7.90 Contact Pad Width (X64) X1 0.20 Contact Pad Length (X64) Y1 0.80 Contact Pad to Center Pad (X64) G1 0.20 Thermal Via Diameter V 0.33 Thermal Via Pitch EV 1.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-2437A  2016 Microchip Technology Inc. DS00002318A-page 6 Document Outline Highlights Target Applications Features 1.0 Introduction 1.1 General Description FIGURE 1-1: Internal Block Diagram 2.0 Package Information 2.1 Package Drawings FIGURE 2-1: Package (Drawing) FIGURE 2-2: Package (Dimensions) FIGURE 2-3: Package (Land Pattern) Appendix A: PRODUCT BRIEF Revision History The Microchip Web Site Product Identification System Worldwide Sales and Service