Datasheet RN4677 (Microchip) - 9

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RN4677 1.12 Mounting Details 1.13 Soldering Recommendations
The RN4677 physical dimensions are shown in The RN4677 wireless module was assembled using Figure 1-6, recommended host PCB footprint in standard lead-free reflow profile IPC/JEDEC J-STD- Figure 1-7, and mounting suggestion in Figure 1-8. No 020. top copper layer must be near the test pin area as The module can be soldered to the host PCB using shown in Figure 1-7. When laying out the host PCB, the standard leaded and lead-free solder reflow profiles. areas under the antenna must not contain any top, inner layer, or bottom copper as shown in Figure 1-8. A To avoid damaging the module, the following low-impedance ground plane ensures best radio recommendations are given: performance (best range; lowest noise). Figure 1-8 • Microchip Technology Application Note “AN233 also shows a minimum ground plane area to the left Solder Reflow Recommendation” (DS00233) and right of the module for best antenna performance. provides solder reflow recommendations The ground plane can be extended beyond the • Do not exceed peak temperature (TP) of 250°C minimum recommended, see Figure 1-7, as required Refer to the solder paste data sheet for specific for host PCB EMC noise reduction. For best range reflow profile recommendations performance, keep all external metal away from the • Use no-clean flux solder paste ceramic chip antenna at least 31 mm. • Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
FIGURE 1-6: RN4677 MODULE DIMENSIONS
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Advance Information
DS50002370A-page 9 Document Outline Bluetooth® 4.0 Dual Mode Module Features Operational RF/Analog Data Throughput MAC/Baseband/Higher Layer Antenna Compliance General Description Applications Table of Contents Most Current Data Sheet Errata Customer Notification System 1.0 Device Overview TABLE 1-1: RN4677 Module Family Types FIGURE 1-1: RN4677 Block Diagram 1.1 Interface Description FIGURE 1-2: RN4677 PIN Diagram FIGURE 1-3: RN4677U PIN Diagram TABLE 1-2: PIN Description 1.2 Configuring the RN4677 1.3 UART Interface 1.4 Control and Indication I/O Pins TABLE 1-3: Configuration And Indication I/O Assignments 1.5 Status Indication I/O Pins TABLE 1-4: Status Indication 1.6 Software Button (SW_BTN) 1.7 WAKE UP (WAKEUP) 1.8 RESET (RST_N) 1.9 Status LED (LED1) 1.10 System Configuration 1.11 Power TABLE 1-5: system configuration settings FIGURE 1-4: RN4677 To MCU Interface Example - LDO FIGURE 1-5: RN4677 To MCU Interface Example - Battery 1.12 Mounting Details 1.13 Soldering Recommendations FIGURE 1-6: RN4677 Module Dimensions FIGURE 1-7: RN4677 Recommended PCB Footprint FIGURE 1-8: RN4677 Host PCB Mounting Suggestion 2.0 Application Information 2.1 RN4677 Ceramic Chip Antenna FIGURE 2-1: RN4677 Antenna Radiation Pattern 2.2 External Configuration and Programming FIGURE 2-2: External Programming Header Connections 3.0 Regulatory Approval 3.1 United States 3.1.1 LABELING AND USER INFORMATION REQUIREMENTS 3.1.2 RF EXPOSURE 3.1.3 HELPFUL WEB SITES 3.2 Canada 3.2.1 LABELING AND USER INFORMATION REQUIREMENTS 3.2.2 RF EXPOSURE 3.2.3 APPROVED EXTERNAL ANTENNA TYPES 3.2.4 HELPFUL WEB SITES 3.3 Europe 3.3.1 LABELING AND USER INFORMATION REQUIREMENTS 3.3.2 EXTERNAL ANTENNA REQUIREMENTS 3.3.3 HELPFUL WEB SITES TABLE 3-1: European Compliance Testing 4.0 Electrical Characteristics TABLE 4-1: Environmental Conditions TABLE 4-2: Electrical Characteristics TABLE 4-3: Supply Consumption-Classic(1) TABLE 4-4: Supply Consumption-low Energy(1) TABLE 4-5: UART Baud 5.0 Ordering Information TABLE 5-1: Ordering Information Appendix A: Revision History Revision A (May 2015) The Microchip Web Site Customer Change Notification Service Customer Support Product Identification System Worldwide Sales and Service