Datasheet ICS-40638 (TDK) - 10
| Manufacturer | TDK |
| Description | High AOP Analog MEMS Microphone with Differential Output |
| Pages / Page | 14 / 10 — ICS‐40638. PCB DESIGN AND LAND PATTERN LAYOUT . 0.522x0.725(4X). … |
| File Format / Size | PDF / 391 Kb |
| Document Language | English |
ICS‐40638. PCB DESIGN AND LAND PATTERN LAYOUT . 0.522x0.725(4X). Ø1.625. Ø1.025. 1.675. 0.838. 0.822. 1.252
Model Line for this Datasheet
Text Version of Document
ICS‐40638
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40638 at a 1:1 ratio to the solder pads on the microphone package (see Figure 9.) Take care to avoid applying solder paste to the sound hole in the PCB. Figure 10 shows a suggested solder paste stencil pattern layout. The response of the ICS‐40638 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro‐ phone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended. Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the performance of the microphone as long as the holes are not partially or completely blocked.
0.522x0.725(4X) Ø1.625 Ø1.025 1.675 0.838 0.822 1.252
Figure 9. Recommended PCB Land Pattern Layout
0.422x0.625(4X) Ø1.625 Ø1.125 1.675 0.1(4x) 0.822 1.252
Figure 10. Recommended Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS‐40638 is not affected by PCB thickness. The ICS‐40638 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. Page 10 of 14 Document Number: DS‐000281 Revision: 1.1
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40638 at a 1:1 ratio to the solder pads on the microphone package (see Figure 9.) Take care to avoid applying solder paste to the sound hole in the PCB. Figure 10 shows a suggested solder paste stencil pattern layout. The response of the ICS‐40638 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro‐ phone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended. Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the performance of the microphone as long as the holes are not partially or completely blocked.
0.522x0.725(4X) Ø1.625 Ø1.025 1.675 0.838 0.822 1.252
Figure 9. Recommended PCB Land Pattern Layout
0.422x0.625(4X) Ø1.625 Ø1.125 1.675 0.1(4x) 0.822 1.252
Figure 10. Recommended Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS‐40638 is not affected by PCB thickness. The ICS‐40638 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. Page 10 of 14 Document Number: DS‐000281 Revision: 1.1
