Datasheet ADCMP606, ADCMP607 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Rail-to-Rail, Very Fast, 2.5 V to 5.5 V, Single-Supply CML Comparator in a 12-lead LSCFP Package |
| Pages / Page | 14 / 6 — ADCMP606/ADCMP607. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL … |
| Revision | C |
| File Format / Size | PDF / 375 Kb |
| Document Language | English |
ADCMP606/ADCMP607. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter. Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
ADCMP606/ADCMP607 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltages soldered in a circuit board for surface-mount packages. Input Supply Voltage (VCCI to GND) −0.5 V to +6.0 V Output Supply Voltage −0.5 V to +6.0 V
Table 4. Thermal Resistance
(V
Package Type θ 1 Unit
CCO to GND)
JA
Positive Supply Differential −6.0 V to +6.0 V ADCMP606 6-Lead SC70 426 °C/W (VCCI − VCCO) ADCMP607 12-Lead LFCSP 62 °C/W Input Voltages 1 Input Voltage −0.5 V to V Measurement in stil air. CCI + 0.5 V Differential Input Voltage ±(V
ESD CAUTION
CCI + 0.5 V) Maximum Input/Output Current ±50 mA Shutdown Control Pin Applied Voltage (SDN to GND) −0.5 V to VCCO + 0.5 V Maximum Input/Output Current ±50 mA Latch/Hysteresis Control Pin Applied Voltage (HYS to GND) −0.5 V to VCCO + 0.5 V Maximum Input/Output Current ±50 mA Output Current ±50 mA Temperature Operating Temperature, Ambient −40°C to +125°C Operating Temperature, Junction 150°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 6 of 14 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS TIMING INFORMATION ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING CML-COMPATIBLE OUTPUT STAGE USING/DISABLING THE LATCH FEATURE OPTIMIZING PERFORMANCE COMPARATOR PROPAGATION DELAY DISPERSION COMPARATOR HYSTERESIS CROSSOVER BIAS POINTS MINIMUM INPUT SLEW RATE REQUIREMENT TYPICAL APPLICATION CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device Supply Voltages soldered in a circuit board for surface-mount packages. Input Supply Voltage (VCCI to GND) −0.5 V to +6.0 V Output Supply Voltage −0.5 V to +6.0 V
Table 4. Thermal Resistance
(V
Package Type θ 1 Unit
CCO to GND)
JA
Positive Supply Differential −6.0 V to +6.0 V ADCMP606 6-Lead SC70 426 °C/W (VCCI − VCCO) ADCMP607 12-Lead LFCSP 62 °C/W Input Voltages 1 Input Voltage −0.5 V to V Measurement in stil air. CCI + 0.5 V Differential Input Voltage ±(V
ESD CAUTION
CCI + 0.5 V) Maximum Input/Output Current ±50 mA Shutdown Control Pin Applied Voltage (SDN to GND) −0.5 V to VCCO + 0.5 V Maximum Input/Output Current ±50 mA Latch/Hysteresis Control Pin Applied Voltage (HYS to GND) −0.5 V to VCCO + 0.5 V Maximum Input/Output Current ±50 mA Output Current ±50 mA Temperature Operating Temperature, Ambient −40°C to +125°C Operating Temperature, Junction 150°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 6 of 14 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS TIMING INFORMATION ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING CML-COMPATIBLE OUTPUT STAGE USING/DISABLING THE LATCH FEATURE OPTIMIZING PERFORMANCE COMPARATOR PROPAGATION DELAY DISPERSION COMPARATOR HYSTERESIS CROSSOVER BIAS POINTS MINIMUM INPUT SLEW RATE REQUIREMENT TYPICAL APPLICATION CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
