Datasheet ADP151 (Analog Devices) - 5

Data Sheet ADP151 ABSOLUTE MAXIMUM RATINGS
Ψ
Table 3.
JB is the junction to board, thermal characterization parameter with units of °C/W. ΨJB of the package is based on modeling
Parameter Rating
and calculation using a 4-layer board. The JESD51-12, VIN to GND −0.3 V to +6.5 V Guidelines for Reporting and Using Electronic Package Thermal VOUT to GND −0.3 V to VIN Information, states that thermal characterization parameters are EN to GND −0.3 V to +6.5V not the same as thermal resistances. ΨJB measures the component Temperature Range power flowing through multiple thermal paths rather than a Storage −65°C to +150°C single path as in θJB. Therefore, ΨJB thermal paths include Operating Junction −40°C to +125°C convection from the top of the package as wel as radiation Operating Ambient −40°C to +125°C from the package, factors that make ΨJB more useful in real- Soldering Conditions JEDEC J-STD-020 world applications. To calculate the maximum TJ from the Stresses at or above those listed under Absolute Maximum board temperature (TB) and PD, use the following equation: Ratings may cause permanent damage to the product. This is a TJ = TB + (PD × ΨJB) stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational See JESD51-8 and JESD51-12 for more detailed information section of this specification is not implied. Operation beyond about ΨJB. the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE THERMAL DATA
θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Absolute maximum ratings apply individually only, not in combination. The ADP151 can be damaged when the junction
Table 4. Thermal Resistance
temperature limits are exceeded. Monitoring ambient temperature
Package Type θJA ΨJB Unit
does not guarantee that TJ is within the specified temperature 5-Lead TSOT (UJ-5) 170 43 °C/W limits. In applications with high power dissipation and poor 4-Ball WLCSP (CB-4-3) 260 58 °C/W thermal resistance, the maximum ambient temperature may 6-Lead LFCSP (CP-6-3) 63.6 28.3 °C/W have to be derated. In applications with moderate power dissipation and low
ESD CAUTION
printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. TJ of the device is dependent on TA, the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θ JA). To calculate the maximum T J from TA and PD use the following equation: TJ = TA + (PD × θJA) The θJA of the package is based on modeling and calculation using a 4-layer board. θJA is highly dependent on the application and board layout. In applications where high maximum PD exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 inches × 3 inches circuit board. See JESD51-7 and JESD51-9 for detailed information on the board construction. For additional information, see the AN-617 Application Note, MicroCSP™ Wafer Level Chip Scale Package. Rev. H | Page 5 of 23 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL DATA THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties ENABLE FEATURE ADJUSTABLE OUTPUT VOLTAGE OPERATION CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS