Datasheet MLX75027 (Melexis) - 5
| Manufacturer | Melexis |
| Description | VGA Time-of-Flight Sensor |
| Pages / Page | 67 / 5 — MLX75027 VGA Time-of-Flight Sensor. Document Revision History. Version. … |
| File Format / Size | PDF / 3.2 Mb |
| Document Language | English |
MLX75027 VGA Time-of-Flight Sensor. Document Revision History. Version. Date. Changes
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MLX75027 VGA Time-of-Flight Sensor
PRELIMINARY DATASHEET
Document Revision History Version Date Changes
0.1 - 0.8 / Draft version(s) Section 3.2: Decreased typical thermal resistance Section 3.4 and 3.5: Updated power consumption Section 3.6: Modified decoupling recommendations Section 3.9: Correction default slave address 0x67 to 0x57 Section 4.2: Updated AC demodulation contrast Section 4.2: Increased wavelength width Section 4.2: Note UV dosis reference for microlens Section 6.2: Update to init map:0x2c0c 0x2c0d moved to section 8, 0x1433 added Section 7.1: Additional registers added for MIPI data rate configuration Section 7.2: Added entering streaming triggers a frame Section 7.4: Correction of 2 Lane HMAX values 0.9 11/09/2020 Section 7.4.2 & 7.12 : Rework of PIXRST & Px_PRETIME definition to PRETIME Section 7.8: Rework of frame time calculations Section 7.17 & 7.23: Updated phase numbering Section 7.18: Added section about analog delay setting Section 8: Added META_LENGTH control register Section 9: Updated example calculation Section 10.1: Increased wavelength width Section 10.8: Added cover tape removal instructions Section 7.14: Removal of note Section Ordering Information: version with cover tape is default General: Correction of floor to roundup in calculations Update to Disclaimer Table 1: Changelog Preliminary Datasheet v0.9 Page 5 of 67 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. VGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function ) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Information 10.1. Transmittance and Reflectance 10.2. Pinout & Equivalent I/O Circuitry 10.3. Mechanical Dimensions 10.4. Package Marking 10.5. PCB Landing Pattern 10.6. Reflow Solder Profile 10.7. Reflow Cleaning Instructions 10.8. Cover Tape Removal Disclaimer
MLX75027 VGA Time-of-Flight Sensor
PRELIMINARY DATASHEET
Document Revision History Version Date Changes
0.1 - 0.8 / Draft version(s) Section 3.2: Decreased typical thermal resistance Section 3.4 and 3.5: Updated power consumption Section 3.6: Modified decoupling recommendations Section 3.9: Correction default slave address 0x67 to 0x57 Section 4.2: Updated AC demodulation contrast Section 4.2: Increased wavelength width Section 4.2: Note UV dosis reference for microlens Section 6.2: Update to init map:0x2c0c 0x2c0d moved to section 8, 0x1433 added Section 7.1: Additional registers added for MIPI data rate configuration Section 7.2: Added entering streaming triggers a frame Section 7.4: Correction of 2 Lane HMAX values 0.9 11/09/2020 Section 7.4.2 & 7.12 : Rework of PIXRST & Px_PRETIME definition to PRETIME Section 7.8: Rework of frame time calculations Section 7.17 & 7.23: Updated phase numbering Section 7.18: Added section about analog delay setting Section 8: Added META_LENGTH control register Section 9: Updated example calculation Section 10.1: Increased wavelength width Section 10.8: Added cover tape removal instructions Section 7.14: Removal of note Section Ordering Information: version with cover tape is default General: Correction of floor to roundup in calculations Update to Disclaimer Table 1: Changelog Preliminary Datasheet v0.9 Page 5 of 67 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. VGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function ) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Information 10.1. Transmittance and Reflectance 10.2. Pinout & Equivalent I/O Circuitry 10.3. Mechanical Dimensions 10.4. Package Marking 10.5. PCB Landing Pattern 10.6. Reflow Solder Profile 10.7. Reflow Cleaning Instructions 10.8. Cover Tape Removal Disclaimer
