Datasheet ISL9122A (Renesas) - 4

link to page 4 link to page 4 link to page 4 link to page 4 ISL9122A 1. Overview
1.2 Ordering Information Part Default I2C Temp Tape and Reel Package Pkg. Part Number Marking VOUT (V) Address Range (°C) (Units) (Note 1 ) (RoHS Compliant) Dwg. #
ISL9122AIINZ-T (Note 2) 122A 3.3V 0x18 -40 to +85 3k 8 Bump WLCSP W2x4.8 ISL9122AIRNZ-T (Note 3) A22 3.3V 0x18 -40 to +85 6k 8 Ld DFN L8.2x3 ISL9122AIRNZ-T7A (Note 3) A22 3.3V 0x18 -40 to +85 250 8 Ld DFN L8.2x3 ISL9122AIIN-EVZ Evaluation Board for ISL9122AIINZ ISL9122AIRN-EVZ Evaluation Board for ISL9122AIRNZ
Notes:
1. See TB347 for details about reel specifications. 2. These Pb-free WLCSP packaged products employ special Pb-free material sets; molding compounds/die attach materials and SnAgCu - e1 solder ball terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free WLCSP packaged products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020. 3. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020. 4. For Moisture Sensitivity Level (MSL), see the ISL9122A device page. For more information on MSL, see TB363.
1.3 Pin Configurations
8 Bump WLCSP 8 Ld DFN Top View Top View
1 2 LX1 1 8 VIN A GND LX2 GND 2 7 SCL 9 EPAD LX2 3 6 SDA B LX1 VOUT VOUT 4 5 EN C VIN EN D SCL SDA 1.4 Pin Descriptions WLCSP Pin # DFN Pin # Pin Names Description
B2 4 VOUT Buck-boost output. A2 3 LX2 Inductor connection, output side. A1 2 GND Ground connection. B1 1 LX1 Inductor connection, input side. C1 8 VIN Power supply input. C2 5 EN Logic input, drive HIGH to enable device. Do not leave floating. D2 6 SDA I2C data input. Pull up to VIN if not being used. Do not leave floating. D1 7 SCL I2C clock input. Pull up to VIN if not being used. Do not leave floating. N/A 9 EPAD Exposed Pad. Must be soldered to PCB GND. FN8947 Rev.1.00 Page 4 of 20 Sep.14.20 Document Outline Features Applications Related Literature Contents 1. Overview 1.1 Block Diagram 1.2 Ordering Information 1.3 Pin Configurations 1.4 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Information 2.3 Recommended Operation Conditions 2.4 Analog Specifications 2.5 I2C Interface Timing Specifications 3. Typical Performance Curves 4. Functional Description 4.1 Enable Input 4.2 Soft Discharge 4.3 Start-Up 4.4 Overcurrent/Short-Circuit Protection 4.5 Thermal Shutdown 4.6 Buck-Boost Conversion Topology 4.7 PWM Operation 4.8 PFM Operation 4.9 Operation With VIN Close to VOUT 4.10 Forced Operating Modes 4.11 I2C Serial Interface 4.12 Protocol Conventions 4.13 Write Operation 4.14 Read Operation 4.15 Register Descriptions 4.15.1 RO_REG1 4.15.2 INTFLG_REG 4.15.3 VSET 4.15.4 CONV_CFG 4.15.5 INTFLG_MASK 5. Revision History 6. Package Outline Drawings