Datasheet OP467 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Quad Precision, High Speed Operational Amplifier |
| Pages / Page | 20 / 6 — OP467. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter1. Rating. THERMAL … |
| Revision | I |
| File Format / Size | PDF / 493 Kb |
| Document Language | English |
OP467. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter1. Rating. THERMAL RESISTANCE. Table 5. Package Type. θ 1. θJC Unit
Model Line for this Datasheet
Text Version of Document
link to page 6 link to page 6 link to page 6 link to page 6 link to page 6 link to page 6
OP467 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter1 Rating
Stresses above those listed under Absolute Maximum Ratings Supply Voltage ±18 V may cause permanent damage to the device. This is a stress Input Voltage2 ±18 V rating only; functional operation of the device at these or any Differential Input Voltage2 ±26 V other conditions above those indicated in the operational Output Short-Circuit Duration Limited section of this specification is not implied. Exposure to absolute Storage Temperature Range maximum rating conditions for extended periods may affect 14-Lead CERDIP and 20-Terminal LCC −65°C to +175°C device reliability. 14-Lead PDIP and 16-Lead SOIC −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range θ OP467A −55°C to +125°C JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. OP467G −40°C to +85°C Junction Temperature Range
Table 5.
14-Lead CERDIP and 20-Terminal LCC −65°C to +175°C
Package Type θ 1 JA θJC Unit
14-Lead PDIP and 16-Lead SOIC −65°C to +150°C 14-Lead CERDIP (Y) 94 10 °C/W Lead Temperature (Soldering, 60 sec) 300°C 14-Lead PDIP (P) 76 33 °C/W 1 Absolute maximum ratings apply to both DICE and packaged parts, unless 16-Lead SOIC (S) 88 23 °C/W otherwise noted. 20-Terminal LCC (RC) 78 33 °C/W 2 For supply voltages less than ±18 V, the absolute maximum input voltage is 1 equal to the supply voltage. θJA is specified for the worst-case conditions, that is, θJA is specified for device in socket for CERDIP, PDIP, and LCC packages, and θJA is specified for device soldered in circuit board for the SOIC package.
DICE CHARACTERISTICS A D T T OU OU –IN A 2 1 14 13 –IN D +IN A 3 12 +IN D V+ 4 11 V– +IN B 5 10 +IN C
05
–IN B 6 7 8 9 –IN C
-0
C
00302
B T T OU OU
Figure 5. 0.111 Inch × 0.100 Inch DIE Size, 11,100 sq. mils, Substrate Connected to V+, 165 Transistors
ESD CAUTION
Rev. * | Page 6 o f 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS WAFER TEST LIMITS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE DICE CHARACTERISTICS ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION OUTPUT SHORT-CIRCUIT PERFORMANCE UNUSED AMPLIFIERS PCB LAYOUT CONSIDERATIONS GROUNDING POWER SUPPLY CONSIDERATIONS SIGNAL CONSIDERATIONS PHASE REVERSAL SATURATION RECOVERY TIME HIGH SPEED INSTRUMENTATION AMPLIFIER 2 MHz BIQUAD BAND-PASS FILTER FAST I-TO-V CONVERTER OP467 SPICE MARCO-MODEL OUTLINE DIMENSIONS ORDERING GUIDE
OP467 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter1 Rating
Stresses above those listed under Absolute Maximum Ratings Supply Voltage ±18 V may cause permanent damage to the device. This is a stress Input Voltage2 ±18 V rating only; functional operation of the device at these or any Differential Input Voltage2 ±26 V other conditions above those indicated in the operational Output Short-Circuit Duration Limited section of this specification is not implied. Exposure to absolute Storage Temperature Range maximum rating conditions for extended periods may affect 14-Lead CERDIP and 20-Terminal LCC −65°C to +175°C device reliability. 14-Lead PDIP and 16-Lead SOIC −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range θ OP467A −55°C to +125°C JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. OP467G −40°C to +85°C Junction Temperature Range
Table 5.
14-Lead CERDIP and 20-Terminal LCC −65°C to +175°C
Package Type θ 1 JA θJC Unit
14-Lead PDIP and 16-Lead SOIC −65°C to +150°C 14-Lead CERDIP (Y) 94 10 °C/W Lead Temperature (Soldering, 60 sec) 300°C 14-Lead PDIP (P) 76 33 °C/W 1 Absolute maximum ratings apply to both DICE and packaged parts, unless 16-Lead SOIC (S) 88 23 °C/W otherwise noted. 20-Terminal LCC (RC) 78 33 °C/W 2 For supply voltages less than ±18 V, the absolute maximum input voltage is 1 equal to the supply voltage. θJA is specified for the worst-case conditions, that is, θJA is specified for device in socket for CERDIP, PDIP, and LCC packages, and θJA is specified for device soldered in circuit board for the SOIC package.
DICE CHARACTERISTICS A D T T OU OU –IN A 2 1 14 13 –IN D +IN A 3 12 +IN D V+ 4 11 V– +IN B 5 10 +IN C
05
–IN B 6 7 8 9 –IN C
-0
C
00302
B T T OU OU
Figure 5. 0.111 Inch × 0.100 Inch DIE Size, 11,100 sq. mils, Substrate Connected to V+, 165 Transistors
ESD CAUTION
Rev. * | Page 6 o f 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS WAFER TEST LIMITS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE DICE CHARACTERISTICS ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION OUTPUT SHORT-CIRCUIT PERFORMANCE UNUSED AMPLIFIERS PCB LAYOUT CONSIDERATIONS GROUNDING POWER SUPPLY CONSIDERATIONS SIGNAL CONSIDERATIONS PHASE REVERSAL SATURATION RECOVERY TIME HIGH SPEED INSTRUMENTATION AMPLIFIER 2 MHz BIQUAD BAND-PASS FILTER FAST I-TO-V CONVERTER OP467 SPICE MARCO-MODEL OUTLINE DIMENSIONS ORDERING GUIDE
