Datasheet LTC3835 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Low IQ Synchronous Step-Down Controller |
| Pages / Page | 30 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION |
| Revision | F |
| File Format / Size | PDF / 818 Kb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION
Model Line for this Datasheet
Text Version of Document
LTC3835
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Supply Voltage (VIN) ... 36V to –0.3V Peak Output Current <10µs (TG,BG) ...3A Top Side Driver Voltage (BOOST) ... 42V to –0.3V INTVCC Peak Output Current ... 50mA Switch Voltage (SW) ... 36V to –5V Operating Temperature Range (Note 2)..–40°C to 85°C INTVCC, (BOOST-SW), CLKOUT, PGOOD .. 8.5V to –0.3V Junction Temperature (Note 3) ... 125°C RUN, TRACK/SS .. 7V to –0.3V Storage Temperature Range SENSE+, SENSE– Voltages ...11V to –0.3V FE Package .. –65°C to 150°C PLLIN/MODE, PHASMD, PLLLPF ...INTVCC to –0.3V Storage Temperature Range EXTVCC ... 10V to –0.3V UFD Package .. –65°C to 125°C ITH, VFB Voltages .. 2.7V to –0.3V Lead Temperature (FE Package, Soldering, 10 sec) ...300°C
PIN CONFIGURATION
TOP VIEW TOP VIEW CLKOUT 1 20 PHASMD PLLLPF 2 19 PLLIN/MODE PLLLPF CLKOUT PHASMD PLLIN/MODE 20 19 18 17 ITH 3 18 PGOOD TRACKS/SS 4 17 SENSE+ ITH 1 16 PGOOD TRACK/SS 2 15 SENSE+ VFB 5 21 16 SENSE– SGND VFB 3 14 SENSE– 21 SGND 6 15 RUN SGND 4 SGND 13 RUN PGND 7 14 BOOST PGND 5 12 BOOST BG 8 13 TG BG 6 11 TG INTVCC 9 12 SW 7 8 9 10 EXTVCC 10 11 VIN V CC V CC V IN SW FE PACKAGE INT EXT 20-LEAD PLASTIC TSSOP UFD PACKAGE T 20-PIN (4mm × 5mm) PLASTIC QFN JMAX = 125°C, θJA = 35°C/W EXPOSED PAD (PIN 21) IS SGND MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 37°C/W EXPOSED PAD (PIN 21) IS SGND MUST BE SOLDERED TO PCB Rev. F 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Supply Voltage (VIN) ... 36V to –0.3V Peak Output Current <10µs (TG,BG) ...3A Top Side Driver Voltage (BOOST) ... 42V to –0.3V INTVCC Peak Output Current ... 50mA Switch Voltage (SW) ... 36V to –5V Operating Temperature Range (Note 2)..–40°C to 85°C INTVCC, (BOOST-SW), CLKOUT, PGOOD .. 8.5V to –0.3V Junction Temperature (Note 3) ... 125°C RUN, TRACK/SS .. 7V to –0.3V Storage Temperature Range SENSE+, SENSE– Voltages ...11V to –0.3V FE Package .. –65°C to 150°C PLLIN/MODE, PHASMD, PLLLPF ...INTVCC to –0.3V Storage Temperature Range EXTVCC ... 10V to –0.3V UFD Package .. –65°C to 125°C ITH, VFB Voltages .. 2.7V to –0.3V Lead Temperature (FE Package, Soldering, 10 sec) ...300°C
PIN CONFIGURATION
TOP VIEW TOP VIEW CLKOUT 1 20 PHASMD PLLLPF 2 19 PLLIN/MODE PLLLPF CLKOUT PHASMD PLLIN/MODE 20 19 18 17 ITH 3 18 PGOOD TRACKS/SS 4 17 SENSE+ ITH 1 16 PGOOD TRACK/SS 2 15 SENSE+ VFB 5 21 16 SENSE– SGND VFB 3 14 SENSE– 21 SGND 6 15 RUN SGND 4 SGND 13 RUN PGND 7 14 BOOST PGND 5 12 BOOST BG 8 13 TG BG 6 11 TG INTVCC 9 12 SW 7 8 9 10 EXTVCC 10 11 VIN V CC V CC V IN SW FE PACKAGE INT EXT 20-LEAD PLASTIC TSSOP UFD PACKAGE T 20-PIN (4mm × 5mm) PLASTIC QFN JMAX = 125°C, θJA = 35°C/W EXPOSED PAD (PIN 21) IS SGND MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 37°C/W EXPOSED PAD (PIN 21) IS SGND MUST BE SOLDERED TO PCB Rev. F 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Package Description Revision History Typical Application Related Parts
