Datasheet SLG46826 (Dialog Semiconductor) - 5
| Manufacturer | Dialog Semiconductor |
| Description | GreenPAK Programmable Mixed-signal Matrix with In System Programmability |
| Pages / Page | 188 / 5 — SLG46826. Datasheet. Revision 3.11. 10-Mar-2020 |
| File Format / Size | PDF / 3.1 Mb |
| Document Language | English |
SLG46826. Datasheet. Revision 3.11. 10-Mar-2020
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SLG46826
GreenPAK Programmable Mixed-Signal Matrix with In-System Programmability Figure 57: ACMP0H Block Diagram.. 91 Figure 58: ACMP1H Block Diagram.. 92 Figure 59: ACMP2L Block Diagram .. 93 Figure 60: ACMP3L Block Diagram .. 94 Figure 61: Typical Propagation Delay vs. Vref for ACMPxH at T = 25 °C, Gain = 1, Buffer - Disabled, Hysteresis = 0 ... 95 Figure 62: Typical Propagation Delay vs. Vref for ACMPxL at T = 25 °C, Gain = 1, Buffer - Disabled, Hysteresis = 0.. 95 Figure 63: ACMPxH Power-On Delay vs. VDD ... 96 Figure 64: ACMPxL Power-On Delay vs. VDD.. 96 Figure 65: ACMPxH Input Offset Voltage vs. Vref at T = -40 °C to 85 °C, Input Buffer Disabled ... 97 Figure 66: ACMPxH Input Offset Voltage vs. Vref at T = -40 °C to 85 °C, Input Buffer Enabled .. 97 Figure 67: ACMPxL Input Offset Voltage vs. Vref at T = -40 °C to 85 °C ... 98 Figure 68: ACMP Input Current Source vs. Input Voltage at T = -40 °C to 85 °C, VDD = 3.3 V .. 98 Figure 69: Programmable Delay ... 99 Figure 70: Edge Detector Output .. 99 Figure 71: Deglitch Filter or Edge Detector ... 100 Figure 72: Voltage Reference Block Diagram ... 102 Figure 73: Typical Load Regulation, Vref = 320 mV, T = -40 °C to +85 °C, Buffer - Enable... 103 Figure 74: Typical Load Regulation, Vref = 640 mV, T = -40 °C to +85 °C, Buffer - Enable... 103 Figure 75: Typical Load Regulation, Vref = 1280 mV, T = -40 °C to +85 °C, Buffer - Enable... 104 Figure 76: Typical Load Regulation, Vref = 2016 mV, T = -40 °C to +85 °C, Buffer - Enable... 104 Figure 77: Oscillator0 Block Diagram.. 106 Figure 78: Oscillator1 Block Diagram.. 107 Figure 79: Oscillator2 Block Diagram.. 108 Figure 80: Clock Scheme.. 109 Figure 81: Oscillator Startup Diagram ... 110 Figure 82: Oscillator0 Maximum Power-On Delay vs. VDD at T = 25 °C, OSC0 = 2.048 kHz... 110 Figure 83: Oscillator1 Maximum Power-On Delay vs. VDD at T = 25 °C, OSC1 = 2.048 MHz ... 111 Figure 84: Oscillator2 Maximum Power-On Delay vs. VDD at T = 25 °C, OSC2 = 25 MHz .. 111 Figure 85: Oscillator0 Frequency vs. Temperature, OSC0 = 2.048 kHz... 112 Figure 86: Oscillator1 Frequency vs. Temperature, OSC1 = 2.048 MHz.. 112 Figure 87: Oscillator2 Frequency vs. Temperature, OSC2 = 25 MHz... 113 Figure 88: Oscillators Total Error vs. Temperature ... 113 Figure 89: POR Sequence .. 116 Figure 90: Internal Macrocell States during POR Sequence... 117 Figure 91: Power-Down... 118 Figure 92: Basic Command Structure ... 119 Figure 93: I2C General Timing Characteristics ... 120 Figure 94: Byte Write Command, R/W = 0.. 120 Figure 95: Sequential Write Command ... 121 Figure 96: Current Address Read Command, R/W = 1... 121 Figure 97: Random Read Command .. 122 Figure 98: Sequential Read Command... 122 Figure 99: Reset Command Timing .. 123 Figure 100: Example of I2C Byte Write Bit Masking ... 126 Figure 101: Page Write Command.. 128 Figure 102: I2C Block Addressing ... 128 Figure 103: Analog Temperature Sensor Structure Diagram.. 132 Figure 104: TS Output vs Temperature, VDD = 2.3 V to 5.5 V .. 133
Datasheet Revision 3.11 10-Mar-2020
5 of 188 © 2020 Dialog Semiconductor CFR0011-120-00 Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 20L 2.2 Pin Configuration - TSSOP-20L 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 Timing Characteristics 3.6 OSC Characteristics 3.6.1 OSC Specifications 3.6.2 OSC Power-On Delay 3.7 ACMP Specifications 3.8 Analog Temperature Sensor Characteristics 4 User Programmability 5 IO Pins 5.1 IO Pins 5.2 GPIO Pins 5.3 GPO Pins 5.4 GPI Pins 5.5 Pull-Up/Down Resistors 5.6 Fast Pull-up/down during Power-up 5.7 I2C Mode IO Structure (VDD or VDD2) 5.7.1 I2C Mode Structure (for SCL and SDA) 5.8 Matrix OE IO Structure (VDD or VDD2) 5.8.1 Matrix OE IO Structure (for IOs 1, 4, 5 with VDD, and IOs 8, 9, 10, 11, 12, 13, 14 with VDD2) 5.9 Register OE IO Structure (VDD or VDD2) 5.9.1 Register OE IO Structure (for IOs 0, 2, 3 with VDD) 5.10 Register OE IO Structure (VDD or VDD2) 5.10.1 Register OE IO Structure (for IO 6 with VDD, and IO 7 with VDD2) 5.11 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUT 7.1.2 Initial Polarity Operations 7.2 2-bit LUT or Programmable Pattern Generator 7.2.1 2-Bit LUT or PGen Macrocell Used as 2-Bit LUT 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.3.2 Initial Polarity Operations 7.4 3-Bit LUT or Pipe Delay/Ripple Counter Macrocell 7.4.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/LATCH with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY/FSM Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY7 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY7 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7 8.2.7 CNT/FSM Mode CNT/DLY0 8.2.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 4-Bit LUT or DFF/LATCH with 16-Bit Counter/Delay Macrocell 8.3.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram 8.3.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs 8.4 Wake and Sleep Controller 9 Analog Comparators 9.1 ACMP0H Block Diagram 9.2 ACMP1H Block Diagram 9.3 ACMP2L Block Diagram 9.4 ACMP3L Block Diagram 9.5 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector Output 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 12.3 Vref Block Diagram 12.4 VREF Load Regulation 13 Clocking 13.1 Oscillator general description 13.2 Oscillator0 (2.048 kHz) 13.3 Oscillator1 (2.048 MHz) 13.4 Oscillator2 (25 MHz) 13.5 CNT/DLY Clock Scheme 13.6 External Clocking 13.6.1 IO0 Source for Oscillator0 (2.048 kHz) 13.6.2 IO10 Source for Oscillator1 (2.048 MHz) 13.6.3 IO8 Source for Oscillator2 (25 MHz) 13.7 Oscillators Power-On Delay 13.8 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 Chip Configuration Data Protection 15.6 I2C Serial Command Register Map 15.7 I2C Additional Options 15.7.1 Reading Counter Data via I2C 15.7.2 I2C Expander 15.7.3 I2C Byte Write Bit Masking 16 Non-Volatile Memory 16.1 Serial NVM Write Operations 16.2 Serial NVM Read Operations 16.3 Serial NVM Erase Operations 16.4 Acknowledge Polling 16.5 Low power standby mode 16.6 Emulated EEPROM Write Protection 17 Analog Temperature Sensor 18 Register Definitions 18.1 Register Map 19 Package Top Marking System Definition 19.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 19.2 TSSOP-20 20 Package Information 20.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD 20.2 Package outlines for TSSOP 20L 173 MIL Green 20.3 STQFN and TSSOP Handling 20.4 Soldering Information 21 Ordering Information 21.1 Tape and Reel Specifications 21.2 Carrier Tape Drawing and Dimensions 21.3 STQFN-20L 21.4 TSSOP-20L 22 Layout Guidelines 22.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 22.2 TSSOP-20 Glossary Revision History
SLG46826
GreenPAK Programmable Mixed-Signal Matrix with In-System Programmability Figure 57: ACMP0H Block Diagram.. 91 Figure 58: ACMP1H Block Diagram.. 92 Figure 59: ACMP2L Block Diagram .. 93 Figure 60: ACMP3L Block Diagram .. 94 Figure 61: Typical Propagation Delay vs. Vref for ACMPxH at T = 25 °C, Gain = 1, Buffer - Disabled, Hysteresis = 0 ... 95 Figure 62: Typical Propagation Delay vs. Vref for ACMPxL at T = 25 °C, Gain = 1, Buffer - Disabled, Hysteresis = 0.. 95 Figure 63: ACMPxH Power-On Delay vs. VDD ... 96 Figure 64: ACMPxL Power-On Delay vs. VDD.. 96 Figure 65: ACMPxH Input Offset Voltage vs. Vref at T = -40 °C to 85 °C, Input Buffer Disabled ... 97 Figure 66: ACMPxH Input Offset Voltage vs. Vref at T = -40 °C to 85 °C, Input Buffer Enabled .. 97 Figure 67: ACMPxL Input Offset Voltage vs. Vref at T = -40 °C to 85 °C ... 98 Figure 68: ACMP Input Current Source vs. Input Voltage at T = -40 °C to 85 °C, VDD = 3.3 V .. 98 Figure 69: Programmable Delay ... 99 Figure 70: Edge Detector Output .. 99 Figure 71: Deglitch Filter or Edge Detector ... 100 Figure 72: Voltage Reference Block Diagram ... 102 Figure 73: Typical Load Regulation, Vref = 320 mV, T = -40 °C to +85 °C, Buffer - Enable... 103 Figure 74: Typical Load Regulation, Vref = 640 mV, T = -40 °C to +85 °C, Buffer - Enable... 103 Figure 75: Typical Load Regulation, Vref = 1280 mV, T = -40 °C to +85 °C, Buffer - Enable... 104 Figure 76: Typical Load Regulation, Vref = 2016 mV, T = -40 °C to +85 °C, Buffer - Enable... 104 Figure 77: Oscillator0 Block Diagram.. 106 Figure 78: Oscillator1 Block Diagram.. 107 Figure 79: Oscillator2 Block Diagram.. 108 Figure 80: Clock Scheme.. 109 Figure 81: Oscillator Startup Diagram ... 110 Figure 82: Oscillator0 Maximum Power-On Delay vs. VDD at T = 25 °C, OSC0 = 2.048 kHz... 110 Figure 83: Oscillator1 Maximum Power-On Delay vs. VDD at T = 25 °C, OSC1 = 2.048 MHz ... 111 Figure 84: Oscillator2 Maximum Power-On Delay vs. VDD at T = 25 °C, OSC2 = 25 MHz .. 111 Figure 85: Oscillator0 Frequency vs. Temperature, OSC0 = 2.048 kHz... 112 Figure 86: Oscillator1 Frequency vs. Temperature, OSC1 = 2.048 MHz.. 112 Figure 87: Oscillator2 Frequency vs. Temperature, OSC2 = 25 MHz... 113 Figure 88: Oscillators Total Error vs. Temperature ... 113 Figure 89: POR Sequence .. 116 Figure 90: Internal Macrocell States during POR Sequence... 117 Figure 91: Power-Down... 118 Figure 92: Basic Command Structure ... 119 Figure 93: I2C General Timing Characteristics ... 120 Figure 94: Byte Write Command, R/W = 0.. 120 Figure 95: Sequential Write Command ... 121 Figure 96: Current Address Read Command, R/W = 1... 121 Figure 97: Random Read Command .. 122 Figure 98: Sequential Read Command... 122 Figure 99: Reset Command Timing .. 123 Figure 100: Example of I2C Byte Write Bit Masking ... 126 Figure 101: Page Write Command.. 128 Figure 102: I2C Block Addressing ... 128 Figure 103: Analog Temperature Sensor Structure Diagram.. 132 Figure 104: TS Output vs Temperature, VDD = 2.3 V to 5.5 V .. 133
Datasheet Revision 3.11 10-Mar-2020
5 of 188 © 2020 Dialog Semiconductor CFR0011-120-00 Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 20L 2.2 Pin Configuration - TSSOP-20L 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 Timing Characteristics 3.6 OSC Characteristics 3.6.1 OSC Specifications 3.6.2 OSC Power-On Delay 3.7 ACMP Specifications 3.8 Analog Temperature Sensor Characteristics 4 User Programmability 5 IO Pins 5.1 IO Pins 5.2 GPIO Pins 5.3 GPO Pins 5.4 GPI Pins 5.5 Pull-Up/Down Resistors 5.6 Fast Pull-up/down during Power-up 5.7 I2C Mode IO Structure (VDD or VDD2) 5.7.1 I2C Mode Structure (for SCL and SDA) 5.8 Matrix OE IO Structure (VDD or VDD2) 5.8.1 Matrix OE IO Structure (for IOs 1, 4, 5 with VDD, and IOs 8, 9, 10, 11, 12, 13, 14 with VDD2) 5.9 Register OE IO Structure (VDD or VDD2) 5.9.1 Register OE IO Structure (for IOs 0, 2, 3 with VDD) 5.10 Register OE IO Structure (VDD or VDD2) 5.10.1 Register OE IO Structure (for IO 6 with VDD, and IO 7 with VDD2) 5.11 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUT 7.1.2 Initial Polarity Operations 7.2 2-bit LUT or Programmable Pattern Generator 7.2.1 2-Bit LUT or PGen Macrocell Used as 2-Bit LUT 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.3.2 Initial Polarity Operations 7.4 3-Bit LUT or Pipe Delay/Ripple Counter Macrocell 7.4.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/LATCH with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY/FSM Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY7 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY7 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7 8.2.7 CNT/FSM Mode CNT/DLY0 8.2.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 4-Bit LUT or DFF/LATCH with 16-Bit Counter/Delay Macrocell 8.3.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram 8.3.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs 8.4 Wake and Sleep Controller 9 Analog Comparators 9.1 ACMP0H Block Diagram 9.2 ACMP1H Block Diagram 9.3 ACMP2L Block Diagram 9.4 ACMP3L Block Diagram 9.5 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector Output 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 12.3 Vref Block Diagram 12.4 VREF Load Regulation 13 Clocking 13.1 Oscillator general description 13.2 Oscillator0 (2.048 kHz) 13.3 Oscillator1 (2.048 MHz) 13.4 Oscillator2 (25 MHz) 13.5 CNT/DLY Clock Scheme 13.6 External Clocking 13.6.1 IO0 Source for Oscillator0 (2.048 kHz) 13.6.2 IO10 Source for Oscillator1 (2.048 MHz) 13.6.3 IO8 Source for Oscillator2 (25 MHz) 13.7 Oscillators Power-On Delay 13.8 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 Chip Configuration Data Protection 15.6 I2C Serial Command Register Map 15.7 I2C Additional Options 15.7.1 Reading Counter Data via I2C 15.7.2 I2C Expander 15.7.3 I2C Byte Write Bit Masking 16 Non-Volatile Memory 16.1 Serial NVM Write Operations 16.2 Serial NVM Read Operations 16.3 Serial NVM Erase Operations 16.4 Acknowledge Polling 16.5 Low power standby mode 16.6 Emulated EEPROM Write Protection 17 Analog Temperature Sensor 18 Register Definitions 18.1 Register Map 19 Package Top Marking System Definition 19.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 19.2 TSSOP-20 20 Package Information 20.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD 20.2 Package outlines for TSSOP 20L 173 MIL Green 20.3 STQFN and TSSOP Handling 20.4 Soldering Information 21 Ordering Information 21.1 Tape and Reel Specifications 21.2 Carrier Tape Drawing and Dimensions 21.3 STQFN-20L 21.4 TSSOP-20L 22 Layout Guidelines 22.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 22.2 TSSOP-20 Glossary Revision History
