Datasheet MAX20361 (Maxim) - 3
| Manufacturer | Maxim |
| Description | Small, Single-/Multi-Cell Solar Harvester with MPPT and Harvest Counter |
| Pages / Page | 32 / 3 — Absolute Maximum Ratings. Package Information 12-WLP. THERMAL RESISTANCE, … |
| File Format / Size | PDF / 1.5 Mb |
| Document Language | English |
Absolute Maximum Ratings. Package Information 12-WLP. THERMAL RESISTANCE, FOUR LAYER BOARD
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MAX20361 Small, Single-/Multi-Cell Solar Harvester with MPPT and Harvest Counter
Absolute Maximum Ratings
SYS, VCC to GND .. -0.3V to +6V Continuous Current into any other Pin .. -0.05A to +0.05A SRC to GND .. -0.3V to +3.5V Continuous Power Dissipation (Multilayer Board) (TA = +70oC, SDA, SCL to GND.. -0.3V to +6V derate 13.73mW/oC above +70oC) ... 1098.4mW WAKE to GND ... -0.3V to (SYS + 0.3V) Operating Temperature Range .. -40oC to +85oC REF, THM to GND.. -0.3V to (V Junction Temperature Range ... -40oC to +150oC CC + 0.3V) LX to GND .. -0.3V to (V Storage Temperature Range ... -40oC to +150oC CC + 0.3V) Soldering Temperature (reflow).. +260oC Continuous Current into LX, GND or SYS ... -0.5A to +0.5A Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 12-WLP
Package Code W121C1+2 Outline Number 21-100426 Land Pattern Number Refer to Application Note 1891
THERMAL RESISTANCE, FOUR LAYER BOARD
Junction-to-Ambient (θJA) 72.82oC/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. www.maximintegrated.com Maxim Integrated | 3 Document Outline General Description Applications Benefits and Features Simplified Block Diagram Absolute Maximum Ratings Package Information Electrical Characteristics Typical Operating Characteristics Bump Configuration Pin Descriptions Detailed Description Boost Converter Harvesting Meter Maximum Power Point Tracking (MPPT) Low-Light Sleep Mode WAKE Output Thermal Monitor Shutdown Cold-Startup Source Clamp I2C Interface Slave Address Bit Transfer Single-Byte Write Burst Write Single Byte Read Burst Read Acknowledge Bits Register Map Applications Information Inductor Selection Capacitor Selection SRC Capacitance SYS and VCC Capacitance nMOS Transistor Selection Typical Application Circuits Solar Application Circuit Ordering Information
Absolute Maximum Ratings
SYS, VCC to GND .. -0.3V to +6V Continuous Current into any other Pin .. -0.05A to +0.05A SRC to GND .. -0.3V to +3.5V Continuous Power Dissipation (Multilayer Board) (TA = +70oC, SDA, SCL to GND.. -0.3V to +6V derate 13.73mW/oC above +70oC) ... 1098.4mW WAKE to GND ... -0.3V to (SYS + 0.3V) Operating Temperature Range .. -40oC to +85oC REF, THM to GND.. -0.3V to (V Junction Temperature Range ... -40oC to +150oC CC + 0.3V) LX to GND .. -0.3V to (V Storage Temperature Range ... -40oC to +150oC CC + 0.3V) Soldering Temperature (reflow).. +260oC Continuous Current into LX, GND or SYS ... -0.5A to +0.5A Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 12-WLP
Package Code W121C1+2 Outline Number 21-100426 Land Pattern Number Refer to Application Note 1891
THERMAL RESISTANCE, FOUR LAYER BOARD
Junction-to-Ambient (θJA) 72.82oC/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. www.maximintegrated.com Maxim Integrated | 3 Document Outline General Description Applications Benefits and Features Simplified Block Diagram Absolute Maximum Ratings Package Information Electrical Characteristics Typical Operating Characteristics Bump Configuration Pin Descriptions Detailed Description Boost Converter Harvesting Meter Maximum Power Point Tracking (MPPT) Low-Light Sleep Mode WAKE Output Thermal Monitor Shutdown Cold-Startup Source Clamp I2C Interface Slave Address Bit Transfer Single-Byte Write Burst Write Single Byte Read Burst Read Acknowledge Bits Register Map Applications Information Inductor Selection Capacitor Selection SRC Capacitance SYS and VCC Capacitance nMOS Transistor Selection Typical Application Circuits Solar Application Circuit Ordering Information
