Datasheet HMC8402 (Analog Devices) - 6

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HMC8402 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC8402 3 4 2 1
002
ADI2014
13853- Figure 2. Pad Configuration
Table 5. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency (RF) Input. This pad is ac-coupled and matched to 50 Ω, and has a large value resistor to GND for ESD protection. See Figure 3 for the interface schematic. 2 VGG2 Gain Control. This pad is dc-coupled and is used to accomplish gain control by bringing this voltage lower and becoming more negative. See Figure 4 for the interface schematic. 3 VDD Power Supply Voltage for the Amplifier. Connect a dc bias to provide drain current (IDQ). See Figure 5 for the interface schematic. 4 RFOUT RF Output. This pad is ac-coupled and matched to 50 Ω, and has a large value resistor to GND for ESD protection. See Figure 6 for the interface schematic. Die Bottom GND Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS VDD RFIN
003 005 13853- 13853- Figure 3. RFIN Interface Schematic Figure 5. VDD Interface Schematic
RFOUT
006 13853-
VGG2
Figure 6. RFOUT Interface Schematic 004 13853-
GND
007 Figure 4. VGG2 Interface Schematic 13853- Figure 7. GND Interface Schematic Rev. E | Page 6 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE