Data SheetHMC8402TYPICAL PERFORMANCE CHARACTERISTICS2016+85°C15+25°C15–55°C10B)14d (INPUT RETURN LOSSS5GAINS13OOUTPUT RETURN LOSS012B)URN LdT–5N (11AI–10G10N AND RE–159AI G–208–257–30048121620242832 008 6 1 1 26101418222630 0 FREQUENCY (GHz) 13853- FREQUENCY (GHz) 13853- Figure 8. Response Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures 00+85°C+85°C+25°C+25°C–2–2–55°C–55°C–4–4–6–6B)B)dd((–8S–8SSSOO–10–10URN L–12URN L–12TTRERE–14–14–16–16–18–18–20–20 012 26101418222630 009 26101418222630FREQUENCY (GHz)FREQUENCY (GHz) 13853- 13853- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures 66+85°C5V+25°C6V–55°C7V558V))44dBdB((EERR33FIGUFIGUEEOISOIS2N2N1100 013 051015202530 010 051015202530FREQUENCY (GHz)FREQUENCY (GHz) 13853- 13853- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Noise Figure vs. Frequency at Various Supply Voltages Rev. E | Page 7 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE