Datasheet ADL5724 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 12.7 GHz to 15.4 GHz, Low Noise Amplifier |
| Pages / Page | 12 / 4 — ADL5724. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| File Format / Size | PDF / 326 Kb |
| Document Language | English |
ADL5724. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
ADL5724 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
θJA is thermal resistance, junction to ambient (°C/W), θJB is Supply Voltages thermal resistance, junction to board (°C/W), and θJC is thermal VCC1 2.25 V resistance, junction to case (°C/W). VCC2 4.1 V
Table 4. Thermal Resistance
Maximum Junction Temperature 150°C/W
Package Type θ 1 1 1 JA θJB θJC Unit
Operating Temperature Range −40°C to +85°C 8-Lead LFCSP 39.90 23.88 3.71 °C/W Storage Temperature Range −55°C to +125°C Lead Temperature Range (Soldering, 60 sec) −65°C to +150°C 1 See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance for a printed circuit board (PCB) with 3 × 4 vias. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
θJA is thermal resistance, junction to ambient (°C/W), θJB is Supply Voltages thermal resistance, junction to board (°C/W), and θJC is thermal VCC1 2.25 V resistance, junction to case (°C/W). VCC2 4.1 V
Table 4. Thermal Resistance
Maximum Junction Temperature 150°C/W
Package Type θ 1 1 1 JA θJB θJC Unit
Operating Temperature Range −40°C to +85°C 8-Lead LFCSP 39.90 23.88 3.71 °C/W Storage Temperature Range −55°C to +125°C Lead Temperature Range (Soldering, 60 sec) −65°C to +150°C 1 See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance for a printed circuit board (PCB) with 3 × 4 vias. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE
