Datasheet HMC1040LP3CE (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | GaAs pHEMT MMIC LOW NOISE AMPLIFIER, 24 - 43.5 GHz |
| Pages / Page | 6 / 4 — HMC1040LP3CE. GaAs pHEMT MMIC LOW NOISE. AMPLIFIER, 24 - 43.5 GHz. … |
| File Format / Size | PDF / 591 Kb |
| Document Language | English |
HMC1040LP3CE. GaAs pHEMT MMIC LOW NOISE. AMPLIFIER, 24 - 43.5 GHz. Current vs. Input Power @ 33 GHz. Absolute Maximum Ratings
Model Line for this Datasheet
Text Version of Document
HMC1040LP3CE
v00.0112
GaAs pHEMT MMIC LOW NOISE AMPLIFIER, 24 - 43.5 GHz Current vs. Input Power @ 33 GHz Absolute Maximum Ratings
80 Drain Bias Voltage +4V Idd 78 rf input power +5 dBm T Channel Temperature 175 °C 76 m Continuous pdiss (T = 85 °C) 0.49 w 74 (derate 5.46 mW/°C above 85 °C) s (mA) Thermal resistance Idd 72 183 °C/w (Channel to ground paddle) e - 70 storage Temperature -65 to +150 °C is operating Temperature -40 to +85 °C 68 o esD sensitivity (HBm) Class 0, 100 V 66 -15 -14 -13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 INPUT POWER (dBm) w N eleCTrosTATiC seNsiTiVe DeViCe oBserVe HANDliNG preCAUTioNs
Outline Drawing
lo s - r ie lif p m A NoTes: 1. pACKAGe BoDY mATeriAl: low sTress iNJeCTioN molDeD plAsTiC siliCA AND siliCoN impreGNATeD. 2. leAD AND GroUND pADDle mATeriAl: Copper AlloY. 3. leAD AND GroUND pADDle plATiNG: 100% mATTe TiN 4. DimeNsioNs Are iN iNCHes [millimeTers]. 5. leAD spACiNG TolerANCe is NoN-CUmUlATiVe. 6. pAD BUrr leNGTH sHAll Be 0.15mm mAX. pAD BUrr HeiGHT sHAll Be 0.05mm mAX. 7. pACKAGe wArp sHAll NoT eXCeeD 0.05mm 8. All GroUND leADs AND GroUND pADDle mUsT Be solDereD To pCB rf GroUND. 9. refer To HiTTiTe AppliCATioN NoTe for sUGGesTeD pCB lAND pATTerN.
Package Information
Part Number package Body material lead finish msl rating package marking [2] HmC1040lp3Ce roHs-compliant low stress injection molded plastic 100% matte sn msl1 [1] H1040 XXXX [1] max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
v00.0112
GaAs pHEMT MMIC LOW NOISE AMPLIFIER, 24 - 43.5 GHz Current vs. Input Power @ 33 GHz Absolute Maximum Ratings
80 Drain Bias Voltage +4V Idd 78 rf input power +5 dBm T Channel Temperature 175 °C 76 m Continuous pdiss (T = 85 °C) 0.49 w 74 (derate 5.46 mW/°C above 85 °C) s (mA) Thermal resistance Idd 72 183 °C/w (Channel to ground paddle) e - 70 storage Temperature -65 to +150 °C is operating Temperature -40 to +85 °C 68 o esD sensitivity (HBm) Class 0, 100 V 66 -15 -14 -13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 INPUT POWER (dBm) w N eleCTrosTATiC seNsiTiVe DeViCe oBserVe HANDliNG preCAUTioNs
Outline Drawing
lo s - r ie lif p m A NoTes: 1. pACKAGe BoDY mATeriAl: low sTress iNJeCTioN molDeD plAsTiC siliCA AND siliCoN impreGNATeD. 2. leAD AND GroUND pADDle mATeriAl: Copper AlloY. 3. leAD AND GroUND pADDle plATiNG: 100% mATTe TiN 4. DimeNsioNs Are iN iNCHes [millimeTers]. 5. leAD spACiNG TolerANCe is NoN-CUmUlATiVe. 6. pAD BUrr leNGTH sHAll Be 0.15mm mAX. pAD BUrr HeiGHT sHAll Be 0.05mm mAX. 7. pACKAGe wArp sHAll NoT eXCeeD 0.05mm 8. All GroUND leADs AND GroUND pADDle mUsT Be solDereD To pCB rf GroUND. 9. refer To HiTTiTe AppliCATioN NoTe for sUGGesTeD pCB lAND pATTerN.
Package Information
Part Number package Body material lead finish msl rating package marking [2] HmC1040lp3Ce roHs-compliant low stress injection molded plastic 100% matte sn msl1 [1] H1040 XXXX [1] max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
