Datasheet ADPA7007 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 20 GHz to 44 GHz, GaAs, pHEMT, 31.5 dBm (>1 W), MMIC Power Amplifier |
| Pages / Page | 23 / 5 — Data Sheet. ADPA7007. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL … |
| File Format / Size | PDF / 596 Kb |
| Document Language | English |
Data Sheet. ADPA7007. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE. Parameter. Rating. Table 5. Thermal Resistance
Model Line for this Datasheet
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link to page 23
Data Sheet ADPA7007 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to system design and Drain Bias Voltage (VDDx) 6.0 V operating environment. Careful attention to the printed circuit Gate Bias Voltage (VGGx) −1.6 V to 0 V board (PCB) thermal design is required. Radio Frequency Input Power (RFIN) 27 dBm θJC is the channel to case thermal resistance, channel to bottom Continuous Power Dissipation (PDISS), 12.33 W of die using die attach epoxy. T = 85°C (Derate 137 mW/°C Above 85°C)
Table 5. Thermal Resistance
Storage Temperature Range −55°C to +150°C
Package Type θJC Unit
Operating Temperature Range −40°C to +85°C EH-18-11 7.3 °C/W Junction Temperature to Maintain 175°C 1,000,000 Hour Mean Time to Failure 1 θJC is determined by simulation under the following conditions: the heat (MTTF) transfer is due solely to thermal conduction from the channel, through the Nominal Junction Temperature 136.1°C ground pad, to the PCB. The ground pad is held constant at the operating temperature of 85°C. (T = 85°C, VDD = 5 V, IDQ = 1400 mA) Peak Reflow Temperature1 260°C
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Moisture Sensitivity Level MSL3 The fol owing ESD information is provided for handling of ESD sensitive devices in an ESD protected area only. 1 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Ratings may cause permanent damage to the product. This is a
ESD Ratings for ADPA7007
stress rating only; functional operation of the product at these
Table 6. ADPA7007, 18-Terminal LCC_HS
or any other conditions above those indicated in the
ESD Model Withstand Threshold (V) Class
operational section of this specification is not implied. Operation beyond the maximum operating conditions for HBM 250 1A extended periods may affect product reliability.
ESD CAUTION
Rev. 0 | Page 5 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION BIASING ADPA7007 WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE AND VNEG FOR ADPA7007 VGGX ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADPA7007 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to system design and Drain Bias Voltage (VDDx) 6.0 V operating environment. Careful attention to the printed circuit Gate Bias Voltage (VGGx) −1.6 V to 0 V board (PCB) thermal design is required. Radio Frequency Input Power (RFIN) 27 dBm θJC is the channel to case thermal resistance, channel to bottom Continuous Power Dissipation (PDISS), 12.33 W of die using die attach epoxy. T = 85°C (Derate 137 mW/°C Above 85°C)
Table 5. Thermal Resistance
Storage Temperature Range −55°C to +150°C
Package Type θJC Unit
Operating Temperature Range −40°C to +85°C EH-18-11 7.3 °C/W Junction Temperature to Maintain 175°C 1,000,000 Hour Mean Time to Failure 1 θJC is determined by simulation under the following conditions: the heat (MTTF) transfer is due solely to thermal conduction from the channel, through the Nominal Junction Temperature 136.1°C ground pad, to the PCB. The ground pad is held constant at the operating temperature of 85°C. (T = 85°C, VDD = 5 V, IDQ = 1400 mA) Peak Reflow Temperature1 260°C
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Moisture Sensitivity Level MSL3 The fol owing ESD information is provided for handling of ESD sensitive devices in an ESD protected area only. 1 See the Ordering Guide for additional information. Stresses at or above those listed under Absolute Maximum Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Ratings may cause permanent damage to the product. This is a
ESD Ratings for ADPA7007
stress rating only; functional operation of the product at these
Table 6. ADPA7007, 18-Terminal LCC_HS
or any other conditions above those indicated in the
ESD Model Withstand Threshold (V) Class
operational section of this specification is not implied. Operation beyond the maximum operating conditions for HBM 250 1A extended periods may affect product reliability.
ESD CAUTION
Rev. 0 | Page 5 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION BIASING ADPA7007 WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE AND VNEG FOR ADPA7007 VGGX ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING OUTLINE DIMENSIONS ORDERING GUIDE
