Datasheet HMC7357LP5GE (Analog Devices) - 6

HMC7357LP5GE
v01.0918
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 5.5 - 8.5 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +9 Vdc Vdd (V) Idd (mA) Gate Bias Voltage (Vgg) -2 to -0.4 Vdc +6 1200 T RF Input Power (RFIN) +22 dBm +7 1200 M Channel Temperature 175 °C +8 1200 Continuous Pdiss (T= 85 °C) 12.2 W (derate 135mW/°C above 85 °C) Adjust Vgg to achieve Idd = 1200 mA R - S Thermal Resistance 7.38 °C/W E (channel to ground paddle) Storage Temperature -65 to 150°C ELECTROSTATIC SENSITIVE DEVICE W Operating Temperature -40 to 85 °C OBSERVE HANDLING PRECAUTIONS O ESD Sensitivity (HBM) Class 1A, passed 250V
24-Lead Lead Frame Chip Scale Package [LFCSP] 5 x 5 mm Body and 0.85 mm Package Height
R & P
(CP-24-20)
A
Outline Drawing Dimensions shown in millimeters
E
DETAIL A (JEDEC 95)
IN
5.10 0.35 5.00 SQ 0.30 PIN 1 INDICATOR 4.90 0.25 AREA PIN 1 INDICATOR AREA OPTIONS 19 24 (SEE DETAIL A) 18 1
S - L
0.65
R
BSC 3.40 EXPOSED 3.25 SQ PAD
IE
3.10 13 6 12 7
LIF
0.45 TOP VIEW 0.20 MIN 0.40 BOTTOM VIEW
P
3.25 REF 0.35 FOR PROPER CONNECTION OF
M
0.90 0.85 THE EXPOSED PAD, REFER TO SIDE VIEW THE PIN CONFIGURATION AND
A
0.80 0.05 MAX 0.02 NOM FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.203 REF PKG-004952 09-10-2018-B
24-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.85 mm Package Height (CP-24-20) Dimensions shown in mil imeters.
Package Information
Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1] H7357 HMC7357LP5GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
6
Document Outline Typical Applications Features General Description Functional Diagram Electrical Specifications Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature P1dB vs. Temperature P1dB vs Supply Voltage Output IP3 vs. Supply Voltage, Pout/tone = +20 dBm Output IM3 @ Vdd = +6V Output IM3 @ Vdd =+7V Output IM3 @ Vdd = +8V Power Compression @ 6 GHz Power Compression @ 7 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Package Information Application Circuit List of Materials for Evaluation PCB EV1HMC7357LP5 [1] Evaluation PCB Pin Descriptions Gain & Power vs. Supply Current @ 7 GHz Gain & Power vs. Supply Voltage @ 7 GHz Power Compression @ 8 GHz Reverse Isolation vs. Temperature Output IP3 vs. Temperature, Pout/tone = +20 dBm Output IP3 vs. Supply Current, Pout/tone = +20 dBm P1dB vs. Supply Current Psat vs. Supply Current Psat vs. Temperature Psat vs. Supply Voltage