Datasheet AD8315 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 50 dB GSM PA Controller |
| Pages / Page | 22 / 6 — AD8315. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. RFIN 1. … |
| Revision | D |
| File Format / Size | PDF / 450 Kb |
| Document Language | English |
AD8315. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. RFIN 1. 8 VPOS. ENBL. ENBL 2. 7 VAPC. TOP VIEW. VSET 3. 6 NC. (Not to Scale)
Model Line for this Datasheet
Text Version of Document
AD8315 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 8 VPOS RFIN 1 8 VPOS ENBL AD8315 ENBL 2 7 VAPC 2 7 VAPC AD8315 TOP VIEW VSET 3 6 NC VSET 3 TOP VIEW 6 NC (Not to Scale) (Not to Scale) FLTR 4 5 COMM FLTR 4 5 COMM
02 0 0-
NC = NO CONNECT
52 01
NOTES 1. NC = NO CONNECTION. 2. THE EXPOSED PADDLE ON THE UNDERSIDE OF THE PACKAGE MUST BE SOLDERED TO A
-046
GROUND PLANE WITH LOW THERMAL AND ELECTRICAL CHARACTERISTICS.
01520 Figure 2. LFCSP Pin Configuration Figure 3. MSOP Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. 2 ENBL Connect to VPOS for Normal Operation Connect Pin to Ground for Disable Mode. 3 VSET Setpoint Input. Nominal input range 0.25 V to 1.4 V. 4 FLTR Integrator Capacitor. Connect between FLTR and COMM. 5 COMM Device Common (Ground). 6 NC No Connection. 7 VAPC Output. Control voltage for gain control element. 8 VPOS Positive Supply Voltage: 2.7 V to 5.5 V. EPAD Exposed Paddle. The exposed paddle, on the underside of the LFCSP package only, must be soldered to a ground plane with low thermal and electrical characteristics. Rev. D | Page 6 of 22 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC THEORY CONTROLLER-MODE LOG AMPS CONTROL LOOP DYNAMICS Example PRACTICAL LOOP A NOTE ABOUT POWER EQUIVALENCY BASIC CONNECTIONS RANGE ON VSET AND RFIN TRANSIENT RESPONSE MOBILE HANDSET POWER CONTROL EXAMPLE ENABLE AND POWER-ON INPUT COUPLING OPTIONS USING THE CHIP SCALE PACKAGE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE
02 0 0-
NC = NO CONNECT
52 01
NOTES 1. NC = NO CONNECTION. 2. THE EXPOSED PADDLE ON THE UNDERSIDE OF THE PACKAGE MUST BE SOLDERED TO A
-046
GROUND PLANE WITH LOW THERMAL AND ELECTRICAL CHARACTERISTICS.
01520 Figure 2. LFCSP Pin Configuration Figure 3. MSOP Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. 2 ENBL Connect to VPOS for Normal Operation Connect Pin to Ground for Disable Mode. 3 VSET Setpoint Input. Nominal input range 0.25 V to 1.4 V. 4 FLTR Integrator Capacitor. Connect between FLTR and COMM. 5 COMM Device Common (Ground). 6 NC No Connection. 7 VAPC Output. Control voltage for gain control element. 8 VPOS Positive Supply Voltage: 2.7 V to 5.5 V. EPAD Exposed Paddle. The exposed paddle, on the underside of the LFCSP package only, must be soldered to a ground plane with low thermal and electrical characteristics. Rev. D | Page 6 of 22 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC THEORY CONTROLLER-MODE LOG AMPS CONTROL LOOP DYNAMICS Example PRACTICAL LOOP A NOTE ABOUT POWER EQUIVALENCY BASIC CONNECTIONS RANGE ON VSET AND RFIN TRANSIENT RESPONSE MOBILE HANDSET POWER CONTROL EXAMPLE ENABLE AND POWER-ON INPUT COUPLING OPTIONS USING THE CHIP SCALE PACKAGE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE
