Datasheet BSS89 (Infineon) - 2
Manufacturer | Infineon |
Description | SIPMOS Small-Signal-Transistor |
Pages / Page | 8 / 2 — Rev. 2.2. BSP89. Thermal Characteristics Parameter. Symbol. Values. Unit. … |
Revision | 02_02 |
File Format / Size | PDF / 668 Kb |
Document Language | English |
Rev. 2.2. BSP89. Thermal Characteristics Parameter. Symbol. Values. Unit. min. typ. max. Characteristics. Electrical Characteristics
Model Line for this Datasheet
Text Version of Document
Rev. 2.2 BSP89 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics
Thermal resistance, junction - soldering point RthJS - - 25 K/W (Pin 4) SMD version, device on PCB: RthJA @ min. footprint - - 115 @ 6 cm2 cooling area 1) - - 70
Electrical Characteristics
, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Values Unit min. typ. max. Static Characteristics
Drain-source breakdown voltage V(BR)DSS 240 - - V VGS=0, ID=250µA Gate threshold voltage, VGS = VDS VGS(th) 0.8 1.4 1.8 ID=108µA Zero gate voltage drain current IDSS µA VDS=240V, VGS=0, Tj=25°C - - 0.1 VDS=240V, VGS=0, Tj=150°C - - 10 Gate-source leakage current IGSS - - 10 nA VGS=20V, VDS=0 Drain-source on-state resistance RDS(on) - 4.9 7.5 W VGS=4.5V, ID=0.32A Drain-source on-state resistance RDS(on) - 4.2 6 VGS=10V, ID=0.35A 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2012-11-29