Datasheet AIS2IH (STMicroelectronics) - 4
| Manufacturer | STMicroelectronics |
| Description | MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications |
| Pages / Page | 63 / 4 — AIS2IH. Pin description. 1.2. Figure 2. Pin connections. Table 1. Pin … |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
AIS2IH. Pin description. 1.2. Figure 2. Pin connections. Table 1. Pin description. Pin #. Name. Function. DS12421. Rev 4. page 4/63
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AIS2IH Pin description 1.2 Pin description Figure 2. Pin connections
Z INT2 INT1 1 Vdd_IO 10 11 12 1 SCL/SPC VDD 9 2 CS GND 8 3 SDO/SA0 X Y RES 7 6 5 4 SDA/SDI/SDO (TOPVIEW) DIRECTION OF THE NC DETECTABLE GND ACCELERATIONS (BOTTOM VIEW)
Table 1. Pin description Pin # Name Function
SCL I²C serial clock (SCL) 1 SPC SPI serial port clock (SPC) SPI enable I²C/SPI mode selection 2(1) CS (1: SPI idle mode / I²C communication enabled; 0: SPI communication mode / I²C disabled) SDO SPI serial data output (SDO) 3(1) SA0 I²C less significant bit of the device address (SA0) SDA I²C serial data (SDA) 4 SDI SPI serial data input (SDI) SDO 3-wire interface serial data output (SDO) 5 NC Internally not connected. Can be tied to VDD, Vdd_IO, or GND. 6 GND 0 V supply 7 RES Connect to GND 8 GND 0 V supply 9 VDD Power supply 10 Vdd_IO Power supply for I/O pins 11 INT2 Interrupt pin 2. Clock input when selected in single data conversion on demand. 12 INT1 Interrupt pin 1 1. SDO/SA0 and CS pins are internally pulled up. Refer to Table 2 for the internal pull-up values (typ).
DS12421
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Rev 4 page 4/63
Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures
AIS2IH Pin description 1.2 Pin description Figure 2. Pin connections
Z INT2 INT1 1 Vdd_IO 10 11 12 1 SCL/SPC VDD 9 2 CS GND 8 3 SDO/SA0 X Y RES 7 6 5 4 SDA/SDI/SDO (TOPVIEW) DIRECTION OF THE NC DETECTABLE GND ACCELERATIONS (BOTTOM VIEW)
Table 1. Pin description Pin # Name Function
SCL I²C serial clock (SCL) 1 SPC SPI serial port clock (SPC) SPI enable I²C/SPI mode selection 2(1) CS (1: SPI idle mode / I²C communication enabled; 0: SPI communication mode / I²C disabled) SDO SPI serial data output (SDO) 3(1) SA0 I²C less significant bit of the device address (SA0) SDA I²C serial data (SDA) 4 SDI SPI serial data input (SDI) SDO 3-wire interface serial data output (SDO) 5 NC Internally not connected. Can be tied to VDD, Vdd_IO, or GND. 6 GND 0 V supply 7 RES Connect to GND 8 GND 0 V supply 9 VDD Power supply 10 Vdd_IO Power supply for I/O pins 11 INT2 Interrupt pin 2. Clock input when selected in single data conversion on demand. 12 INT1 Interrupt pin 1 1. SDO/SA0 and CS pins are internally pulled up. Refer to Table 2 for the internal pull-up values (typ).
DS12421
-
Rev 4 page 4/63
Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures
