Datasheet MBRS320P, MBRS330P, MBRS340P (ON Semiconductor)
| Manufacturer | ON Semiconductor |
| Description | Surface Mount Schottky Power Rectifier |
| Pages / Page | 5 / 1 — www.onsemi.com. SCHOTTKY BARRIER. RECTIFIERS. 3.0 AMPERES. Features. 20, … |
| File Format / Size | PDF / 192 Kb |
| Document Language | English |
www.onsemi.com. SCHOTTKY BARRIER. RECTIFIERS. 3.0 AMPERES. Features. 20, 30, 40 VOLTS. SMC 2−LEAD. CASE 403AC. MARKING DIAGRAM
Model Line for this Datasheet
Text Version of Document
MBRS320P, MBRS330P, MBRS340P Surface Mount Schottky Power Rectifier These devices employ the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features
www.onsemi.com
epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or
SCHOTTKY BARRIER
as free wheeling and polarity protection diodes, in surface mount
RECTIFIERS
applications where compact size and weight are critical to the system.
3.0 AMPERES Features 20, 30, 40 VOLTS
• Small Compact Surface Mountable Package with J-Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop
SMC 2−LEAD
(0.5 V Max @ 3.0 A, TJ = 25°C)
CASE 403AC
• Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guard-Ring for Stress Protection
MARKING DIAGRAM
• Device Passes ISO 7637 Pulse #1 • AYWW These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS B3xG Compliant G
Mechanical Characteristics
B3x = Device Code • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 x = 2, 3 or 4 • Weight: 217 mg (Approximately) A = Assembly Location* Y = Year • Finish: All External Surfaces Corrosion Resistant and Terminal WW = Work Week Leads are Readily Solderable G = Pb−Free Package • Lead and Mounting Surface Temperature for Soldering Purposes: (Note: Microdot may be in either location) 260°C Max. for 10 Seconds * The Assembly Location code (A) is front side • Cathode Polarity Band optional. In cases where the Assembly Location is • stamped in the package, the front side assembly Device Meets MSL 1 Requirements code may be blank. • ESD Ratings: ♦ Machine Model = C (> 400 V)
ORDERING INFORMATION
♦ Human Body Model = 3B (> 8000 V)
Device Package Shipping
† MBRS320PT3G SMC 2−Lead 2,500 / (Pb−Free) Tape & Reel MBRS330PT3G SMC 2−Lead 2,500 / (Pb−Free) Tape & Reel MBRS340PT3G SMC 2−Lead 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
August, 2017 − Rev. 2 MBRS320P/D
www.onsemi.com
epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or
SCHOTTKY BARRIER
as free wheeling and polarity protection diodes, in surface mount
RECTIFIERS
applications where compact size and weight are critical to the system.
3.0 AMPERES Features 20, 30, 40 VOLTS
• Small Compact Surface Mountable Package with J-Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop
SMC 2−LEAD
(0.5 V Max @ 3.0 A, TJ = 25°C)
CASE 403AC
• Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guard-Ring for Stress Protection
MARKING DIAGRAM
• Device Passes ISO 7637 Pulse #1 • AYWW These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS B3xG Compliant G
Mechanical Characteristics
B3x = Device Code • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 x = 2, 3 or 4 • Weight: 217 mg (Approximately) A = Assembly Location* Y = Year • Finish: All External Surfaces Corrosion Resistant and Terminal WW = Work Week Leads are Readily Solderable G = Pb−Free Package • Lead and Mounting Surface Temperature for Soldering Purposes: (Note: Microdot may be in either location) 260°C Max. for 10 Seconds * The Assembly Location code (A) is front side • Cathode Polarity Band optional. In cases where the Assembly Location is • stamped in the package, the front side assembly Device Meets MSL 1 Requirements code may be blank. • ESD Ratings: ♦ Machine Model = C (> 400 V)
ORDERING INFORMATION
♦ Human Body Model = 3B (> 8000 V)
Device Package Shipping
† MBRS320PT3G SMC 2−Lead 2,500 / (Pb−Free) Tape & Reel MBRS330PT3G SMC 2−Lead 2,500 / (Pb−Free) Tape & Reel MBRS340PT3G SMC 2−Lead 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
August, 2017 − Rev. 2 MBRS320P/D
