Datasheet LM337 (ON Semiconductor) - 10

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS D2PAK
CASE 936−03 ISSUE E DATE 29 SEP 2015
SCALE 1:1
NOTES:
T T
1. DIMENSIONING AND TOLERANCING PER ANSI
TERMINAL 4
Y14.5M, 1982.
C C
2. CONTROLLING DIMENSION: INCHES.
A K U
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
OPTIONAL ED OPTIONAL ES
A AND K.
CHAMFER CHAMFER
4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4.
S V
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH
B H DETAIL C DETAIL C
AND GATE PROTRUSIONS NOT TO EXCEED
1 2 3
0.025 (0.635) MAXIMUM. 6. SINGLE GAUGE DESIGN WILL BE SHIPPED AF­ TER FPCN EXPIRATION IN OCTOBER 2011.
J INCHES MILLIMETERS F DIM MIN MAX MIN MAX SIDE VIEW BOTTOM VIEW SIDE VIEW A
0.386 0.403 9.804 10.236
DUAL GAUGE G SINGLE GAUGE CONSTRUCTION B
0.356 0.368 9.042 9.347
2X D CONSTRUCTION C
0.170 0.180 4.318 4.572 0.010 (0.254) M
D
0.026 0.036 0.660 0.914 T
TOP VIEW ED
0.045 0.055 1.143 1.397
ES
0.018 0.026 0.457 0.660
F
0.051 REF 1.295 REF
G
0.100 BSC 2.540 BSC
H
0.539 0.579 13.691 14.707
J
0.125 MAX 3.175 MAX
T N K
0.050 REF 1.270 REF
M L
0.000 0.010 0.000 0.254
M
0.088 0.102 2.235 2.591
SEATING N
0.018 0.026 0.457 0.660
P L PLANE P
0.058 0.078 1.473 1.981
R
0_ 8_ 0_ 8_
R BOTTOM VIEW S
0.116 REF 2.946 REF
DETAIL C OPTIONAL CONSTRUCTIONS U
0.200 MIN 5.080 MIN
V
0.250 MIN 6.350 MIN
SOLDERING FOOTPRINT* GENERIC
10.490
MARKING DIAGRAM*
XXXXXXG 8.380 ALYWW 16.155 XXXXXX = Specific Device Code 2X A = Assembly Location 3.504 L = Wafer Lot Y = Year 2X 1.016 WW = Work Week 5.080 G = Pb−Free Package PITCH DIMENSIONS: MILLIMETERS *This information is generic. Please refer to *For additional information on our Pb−Free strategy and soldering device data sheet for actual part marking. details, please download the ON Semiconductor Soldering and Pb−Free indicator, “G” or microdot “ G”, Mounting Techniques Reference Manual, SOLDERRM/D. may or may not be present.
DOCUMENT NUMBER: 98ASH01005A
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: D2PAK PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com