Datasheet MIC5209 (Microchip) - 7
| Manufacturer | Microchip |
| Description | 500 mA Low-Noise LDO Regulator |
| Pages / Page | 30 / 7 — MIC5209. TEMPERATURE SPECIFICATIONS (Note 1). Parameters. Sym. Min. Typ. … |
| File Format / Size | PDF / 2.9 Mb |
| Document Language | English |
MIC5209. TEMPERATURE SPECIFICATIONS (Note 1). Parameters. Sym. Min. Typ. Max. Units. Conditions. Temperature Ranges
Model Line for this Datasheet
- MIC5209-1.8YM MIC5209-1.8YM-TR MIC5209-1.8YU MIC5209-1.8YU-TR MIC5209-2.5YM MIC5209-2.5YM-TR MIC5209-2.5YS MIC5209-2.5YS-TR MIC5209-2.5YU MIC5209-2.5YU-TR MIC5209-3.0YM MIC5209-3.0YM-TR MIC5209-3.0YS MIC5209-3.0YS-TR MIC5209-3.0YU MIC5209-3.0YU-TR MIC5209-3.3YM MIC5209-3.3YM-TR MIC5209-3.3YS MIC5209-3.3YS-TR MIC5209-3.3YU MIC5209-3.3YU-TR MIC5209-3.6YM MIC5209-3.6YM-TR MIC5209-3.6YS MIC5209-3.6YS-TR MIC5209-3.6YU MIC5209-3.6YU-TR MIC5209-4.2YS MIC5209-4.2YS-TR MIC5209-5.0YM MIC5209-5.0YM-TR MIC5209-5.0YS MIC5209-5.0YS-TR MIC5209-5.0YU MIC5209-5.0YU-TR MIC5209YM MIC5209YM-TR MIC5209YML-T5 MIC5209YML-TR MIC5209YU MIC5209YU-TR
Text Version of Document
link to page 7 link to page 12 link to page 12
MIC5209 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5 sec. Junction Temperature TJ –40 — +125 °C 2.5V ≤ VOUT ≤ 15V Junction Temperature TJ 0 — +125 °C 1.8V ≤ VOUT < 2.5V
Package Thermal Resistance
θJA — 62 — °C/W EIA/JEDEC Thermal Resistance SOT-223 JES51-751-7, θJC — 15 — °C/W 4 Layer Board θJA — 50 — °C/W See Thermal Thermal Resistance SOIC-8 Considerations for more θJC — 25 — °C/W information. θJA — 31.4 — °C/W EIA/JEDEC Thermal Resistance DDPAK JES51-751-7, θJC — 3 — °C/W 4 Layer Board Thermal Resistance 3 mm x 3 mm θJA — 64 — °C/W EIA/JEDEC VDFN JES51-751-7, θJC — 12 — °C/W 4 Layer Board
Note 1:
The maximum al owable power dissipation is a function of ambient temperature, the maximum al owable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum al owable power dissipation wil cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 7 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Pin Descriptions 4.0 Applications Information 4.1 Enable/Shutdown 4.2 Input Capacitor 4.3 Output Capacitor 4.4 No-Load Stability 4.5 Reference Bypass Capacitor 4.6 Thermal Considerations 4.7 Low-Voltage Operation 4.8 Fixed Regulator Applications 4.9 Adjustable Regulator Applications 4.10 Slot-1 Power Supply 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
MIC5209 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5 sec. Junction Temperature TJ –40 — +125 °C 2.5V ≤ VOUT ≤ 15V Junction Temperature TJ 0 — +125 °C 1.8V ≤ VOUT < 2.5V
Package Thermal Resistance
θJA — 62 — °C/W EIA/JEDEC Thermal Resistance SOT-223 JES51-751-7, θJC — 15 — °C/W 4 Layer Board θJA — 50 — °C/W See Thermal Thermal Resistance SOIC-8 Considerations for more θJC — 25 — °C/W information. θJA — 31.4 — °C/W EIA/JEDEC Thermal Resistance DDPAK JES51-751-7, θJC — 3 — °C/W 4 Layer Board Thermal Resistance 3 mm x 3 mm θJA — 64 — °C/W EIA/JEDEC VDFN JES51-751-7, θJC — 12 — °C/W 4 Layer Board
Note 1:
The maximum al owable power dissipation is a function of ambient temperature, the maximum al owable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum al owable power dissipation wil cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 7 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Pin Descriptions 4.0 Applications Information 4.1 Enable/Shutdown 4.2 Input Capacitor 4.3 Output Capacitor 4.4 No-Load Stability 4.5 Reference Bypass Capacitor 4.6 Thermal Considerations 4.7 Low-Voltage Operation 4.8 Fixed Regulator Applications 4.9 Adjustable Regulator Applications 4.10 Slot-1 Power Supply 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
