Datasheet TDA7052A, TDA7052AT (NXP) - 9

ManufacturerNXP
Description1 W BTL Mono Audio Amplifier With DC Volume Control
Pages / Page14 / 9 — PACKAGE OUTLINES. DIP8: plastic dual in-line package; 8 leads (300 mil). …
File Format / SizePDF / 298 Kb
Document LanguageEnglish

PACKAGE OUTLINES. DIP8: plastic dual in-line package; 8 leads (300 mil). SOT97-1

PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

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Text Version of Document

NXP Semiconductors Product specification 1 W BTL mono audio amplifier with DC TDA7052A/AT volume control
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D ME A2 A seating plane A L 1 c Z w M b1 e (e ) 1 MH b b2 8 5 pin 1 index E 1 4 0 5 10 mm scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions) A A A UNIT 1 2 b b (1) (1) (1) b e L M w max. 1 2 c D E e M Z 1 E H min. max. max.
1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0 mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15 1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3 inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.39 0.17 0.02 0.13 0.1 0.3 0.01 0.045 0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
99-12-27 SOT97-1 050G01 MO-001 SC-504-8 03-02-13 July 1994 9 Document Outline Features General description Missing Current Limiter (MCL) Quick reference data Ordering information Pinning Functional description Limiting values Thermal resistance Characteristics Application information Package outlines Soldering Introduction DIP SO Data sheet status Disclaimers