Datasheet TLV9161, TLV9162, TLV9164 (Texas Instruments)
| Manufacturer | Texas Instruments |
| Description | TLV916x 16V, 11MHz, Rail-to-Rail Input/Output, Low Offset Voltage, Low Noise Op Amp |
| Pages / Page | 69 / 1 — TLV9161,. TLV9162,. TLV9164. TLV916x 16V, 11MHz, Rail-to-Rail … |
| File Format / Size | PDF / 4.7 Mb |
| Document Language | English |
TLV9161,. TLV9162,. TLV9164. TLV916x 16V, 11MHz, Rail-to-Rail Input/Output, Low Offset Voltage,. Low Noise Op Amp. 1 Features
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TLV9161, TLV9162, TLV9164
SBOSA68D – NOVEMBER 2021 – REVISED MARCH 2024
TLV916x 16V, 11MHz, Rail-to-Rail Input/Output, Low Offset Voltage, Low Noise Op Amp 1 Features 3 Description
• Low offset voltage: ±210µV The TLV916x family (TLV9161, TLV9162, and • Low offset voltage drift: ±0.25µV/°C TLV9164) is a family of 16V, general-purpose • Low noise: 6.8nV/√Hz at 1kHz, 4.2nV/√Hz operational amplifiers. These devices offer broadband exceptional DC precision and AC performance, • High common-mode rejection: 110dB including rail-to-rail input/output, low offset (±210µV, • Low bias current: ±10pA typical), low-offset drift (±0.25µV/°C, typ), and low • Rail-to-rail input and output noise (6.8nV/√Hz at 1kHz, 4.2nV/√Hz at 10kHz). • MUX-friendly/comparator inputs Features such as differential and common-mode input – Amplifier operates with differential inputs up to voltage ranges to the supply rails, high short-circuit supply rails current (±73mA), and high slew rate (33V/µs) make – Amplifier can be used in open-loop or as the TLV916x a flexible, robust, and high-performance comparator op amp for industrial applications. • Wide bandwidth: 11MHz GBW, unity-gain stable • High slew rate: 33V/µs The TLV916x family of op amps is available in small- • Low quiescent current: 2.4mA per amplifier size packages (such as X2QFN and WSON), as well • Wide supply: ±1.35V to ±8V, 2.7V to 16V as standard packages (such as SOT-23, SOIC, and • Robust EMIRR performance TSSOP), and is specified from –40°C to 125°C.
Device Information 2 Applications PART NUMBER
(1)
CHANNEL PACKAGE PACKAGE SIZE
(2)
COUNT
• Professional microphones and wireless systems DCK (SC70, 5) 2.00mm × 2.10mm • Multiplexed data-acquisition systems TLV9161 Single DBV (SOT-23, 5) 2.90mm × 2.80mm • Test and measurement equipment TLV9161S Single, Shutdown DBV (SOT-23, 6) 2.90mm × 2.80mm • Factory automation and control D (SOIC, 8) 4.90mm × 6.00mm • High-side and low-side current sensing DDF (SOT-23, 8) 2.90mm × 2.80mm TLV9162 Dual PW (TSSOP, 8) 3.00mm × 6.40mm DGK (VSSOP, 8) 3.00mm × 4.90mm DSG (WSON, 8) 2.00mm × 2.00mm TLV9162S Dual, Shutdown RUG (X2QFN, 10) 1.50mm × 2.00mm D (SOIC, 14) 8.65mm × 6.00mm TLV9164 Quad PW (TSSOP, 14) 5.00mm × 6.40mm (1) For more information, see Section 10 (2) The package size (length × width) is a nominal value and includes pins, where applicable. TLV916x + + V R System shunt shunt + MCU - Load Vo - - Iload GND + + Vbus V – bus – Iload GND TLV916x System + MCU + Load Vshunt R + shunt - - Vo - GND GND GND GND Low-Side Current Sense High-Side Current Sense
TLV916x in Current-Sensing Applications
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Pin Configuration and Functions 5 Specifications 5.1 Absolute Maximum Ratings 5.2 ESD Ratings 5.3 Recommended Operating Conditions 5.4 Thermal Information for Single Channel 5.5 Thermal Information for Dual Channel 5.6 Thermal Information for Quad Channel 5.7 Electrical Characteristics 5.8 Typical Characteristics 6 Detailed Description 6.1 Overview 6.2 Functional Block Diagram 6.3 Feature Description 6.3.1 Input Protection Circuitry 6.3.2 EMI Rejection 6.3.3 Thermal Protection 6.3.4 Capacitive Load and Stability 6.3.5 Common-Mode Voltage Range 6.3.6 Phase Reversal Protection 6.3.7 Electrical Overstress 6.3.8 Overload Recovery 6.3.9 Typical Specifications and Distributions 6.3.10 Packages With an Exposed Thermal Pad 6.3.11 Shutdown 6.4 Device Functional Modes 7 Application and Implementation 7.1 Application Information 7.2 Typical Applications 7.2.1 Low-Side Current Measurement 7.2.1.1 Design Requirements 7.2.1.2 Detailed Design Procedure 7.2.1.3 Application Curve 7.2.2 Buffered Multiplexer 7.3 Power Supply Recommendations 7.4 Layout 7.4.1 Layout Guidelines 7.4.2 Layout Example 8 Device and Documentation Support 8.1 Device Support 8.1.1 Development Support 8.1.1.1 TINA-TI™ (Free Software Download) 8.2 Documentation Support 8.2.1 Related Documentation 8.3 Receiving Notification of Documentation Updates 8.4 Support Resources 8.5 Trademarks 8.6 Electrostatic Discharge Caution 8.7 Glossary 9 Revision History 10 Mechanical, Packaging, and Orderable Information
TLV9161, TLV9162, TLV9164
SBOSA68D – NOVEMBER 2021 – REVISED MARCH 2024
TLV916x 16V, 11MHz, Rail-to-Rail Input/Output, Low Offset Voltage, Low Noise Op Amp 1 Features 3 Description
• Low offset voltage: ±210µV The TLV916x family (TLV9161, TLV9162, and • Low offset voltage drift: ±0.25µV/°C TLV9164) is a family of 16V, general-purpose • Low noise: 6.8nV/√Hz at 1kHz, 4.2nV/√Hz operational amplifiers. These devices offer broadband exceptional DC precision and AC performance, • High common-mode rejection: 110dB including rail-to-rail input/output, low offset (±210µV, • Low bias current: ±10pA typical), low-offset drift (±0.25µV/°C, typ), and low • Rail-to-rail input and output noise (6.8nV/√Hz at 1kHz, 4.2nV/√Hz at 10kHz). • MUX-friendly/comparator inputs Features such as differential and common-mode input – Amplifier operates with differential inputs up to voltage ranges to the supply rails, high short-circuit supply rails current (±73mA), and high slew rate (33V/µs) make – Amplifier can be used in open-loop or as the TLV916x a flexible, robust, and high-performance comparator op amp for industrial applications. • Wide bandwidth: 11MHz GBW, unity-gain stable • High slew rate: 33V/µs The TLV916x family of op amps is available in small- • Low quiescent current: 2.4mA per amplifier size packages (such as X2QFN and WSON), as well • Wide supply: ±1.35V to ±8V, 2.7V to 16V as standard packages (such as SOT-23, SOIC, and • Robust EMIRR performance TSSOP), and is specified from –40°C to 125°C.
Device Information 2 Applications PART NUMBER
(1)
CHANNEL PACKAGE PACKAGE SIZE
(2)
COUNT
• Professional microphones and wireless systems DCK (SC70, 5) 2.00mm × 2.10mm • Multiplexed data-acquisition systems TLV9161 Single DBV (SOT-23, 5) 2.90mm × 2.80mm • Test and measurement equipment TLV9161S Single, Shutdown DBV (SOT-23, 6) 2.90mm × 2.80mm • Factory automation and control D (SOIC, 8) 4.90mm × 6.00mm • High-side and low-side current sensing DDF (SOT-23, 8) 2.90mm × 2.80mm TLV9162 Dual PW (TSSOP, 8) 3.00mm × 6.40mm DGK (VSSOP, 8) 3.00mm × 4.90mm DSG (WSON, 8) 2.00mm × 2.00mm TLV9162S Dual, Shutdown RUG (X2QFN, 10) 1.50mm × 2.00mm D (SOIC, 14) 8.65mm × 6.00mm TLV9164 Quad PW (TSSOP, 14) 5.00mm × 6.40mm (1) For more information, see Section 10 (2) The package size (length × width) is a nominal value and includes pins, where applicable. TLV916x + + V R System shunt shunt + MCU - Load Vo - - Iload GND + + Vbus V – bus – Iload GND TLV916x System + MCU + Load Vshunt R + shunt - - Vo - GND GND GND GND Low-Side Current Sense High-Side Current Sense
TLV916x in Current-Sensing Applications
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Pin Configuration and Functions 5 Specifications 5.1 Absolute Maximum Ratings 5.2 ESD Ratings 5.3 Recommended Operating Conditions 5.4 Thermal Information for Single Channel 5.5 Thermal Information for Dual Channel 5.6 Thermal Information for Quad Channel 5.7 Electrical Characteristics 5.8 Typical Characteristics 6 Detailed Description 6.1 Overview 6.2 Functional Block Diagram 6.3 Feature Description 6.3.1 Input Protection Circuitry 6.3.2 EMI Rejection 6.3.3 Thermal Protection 6.3.4 Capacitive Load and Stability 6.3.5 Common-Mode Voltage Range 6.3.6 Phase Reversal Protection 6.3.7 Electrical Overstress 6.3.8 Overload Recovery 6.3.9 Typical Specifications and Distributions 6.3.10 Packages With an Exposed Thermal Pad 6.3.11 Shutdown 6.4 Device Functional Modes 7 Application and Implementation 7.1 Application Information 7.2 Typical Applications 7.2.1 Low-Side Current Measurement 7.2.1.1 Design Requirements 7.2.1.2 Detailed Design Procedure 7.2.1.3 Application Curve 7.2.2 Buffered Multiplexer 7.3 Power Supply Recommendations 7.4 Layout 7.4.1 Layout Guidelines 7.4.2 Layout Example 8 Device and Documentation Support 8.1 Device Support 8.1.1 Development Support 8.1.1.1 TINA-TI™ (Free Software Download) 8.2 Documentation Support 8.2.1 Related Documentation 8.3 Receiving Notification of Documentation Updates 8.4 Support Resources 8.5 Trademarks 8.6 Electrostatic Discharge Caution 8.7 Glossary 9 Revision History 10 Mechanical, Packaging, and Orderable Information
