Datasheet ADG774 (Analog Devices) - 4

ADG774 ABSOLUTE MAXIMUM RATINGS1
QSOP Package, Power Dissipation . 566 mW (T A = 25°C unless otherwise noted.) JA Thermal Impedance . 149.97°C/W V Lead Temperature, Soldering (10 sec) . 300°C DD to GND . –0.3 V to +6 V Analog, Digital Inputs2 . –0.3 V to V I R Reflow, Peak Temperature (<20 sec) . 235°C DD + 0.3 V or 30 mA, Whichever Occurs First ESD . 2 kV Continuous Current, S or D . 100 mA NOTES Peak Current, S or D . 300 mA 1Stresses above those listed under Absolute Maximum Ratings may cause perma- (Pulsed at 1 ms, 10% Duty Cycle max) nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational Operating Temperature Range sections of this specification is not implied. Exposure to absolute maximum rating Industrial (B Version) . –40°C to +125°C conditions for extended periods may affect device reliability. Only one absolute Storage Temperature Range . –65°C to +150°C maximum rating may be applied at any one time. 2 Junction Temperature . 150°C Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. SOIC Package, Power Dissipation . 600 mW JA Thermal Impedance . 100°C/W
ORDERING GUIDE Model Temperature Range Package Descriptions Package Options
ADG774BR –40°C to +125°C Standard Small Outline Package (SOIC) R-16 ADG774BR-REEL –40°C to +125°C Standard Small Outline Package (SOIC) R-16 ADG774BR-REEL7 –40°C to +125°C Standard Small Outline Package (SOIC) R-16 ADG774BRZ* –40°C to +125°C Standard Small Outline Package (SOIC) R-16 ADG774BRZ-REEL* –40°C to +125°C Standard Small Outline Package (SOIC) R-16 ADG774BRZ-REEL7* –40°C to +125°C Standard Small Outline Package (SOIC) R-16 ADG774BRQ –40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG774BRQ-REEL –40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG774BRQ-REEL7 –40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG774BRQZ* –40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG774BRQZ-REEL* –40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG774BRQZ-REEL7* –40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 *Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG774 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. C Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE PIN CONFIGURATION TERMINOLOGY Typical Performance Characteristics Test Circuits OUTLINE DIMENSIONS Revision History