Datasheet REF3430 (Texas Instruments) - 8
| Manufacturer | Texas Instruments |
| Description | 3-V, low-drift, low-power, small-footprint series voltage reference |
| Pages / Page | 31 / 8 — REF3425. , REF3430, REF3433, REF3440, REF3450. www.ti.com. 7.5 Electrical … |
| File Format / Size | PDF / 2.5 Mb |
| Document Language | English |
REF3425. , REF3430, REF3433, REF3440, REF3450. www.ti.com. 7.5 Electrical Characteristics (continued). PARAMETER. TEST CONDITION
Model Line for this Datasheet
Text Version of Document
REF3425 , REF3430, REF3433, REF3440, REF3450
SBAS804F – SEPTEMBER 2017 – REVISED JUNE 2021
www.ti.com 7.5 Electrical Characteristics (continued)
At VIN = VOUT + VDO, COUT = 10 µF, CIN = 0.1 µF, IL = 0 mA, minimum and maximum specifications at TA = –40℃ to 125℃; Typical specifications at TA = 25℃ unless otherwise noted
PARAMETER TEST CONDITION MIN TYP MAX UNIT
Voltage reference in active mode (EN = 1) 1.6 VEN ENABLE pin voltage V Voltage reference in shutdown mode (EN = 0) 0.5 IL = 0 mA 50 100 VDO Dropout voltage mV IL = 10 mA 500 ENABLE pin leakage IEN V current EN = VIN = 12V 1 2 µA (1) Temperature drift is specified according to the box method. See Low Temperature Drift section for more details. (2) VDO for line regulation test is 50 mV. (3) VDO for load regulation test is 500 mV. (4) The peak-to-peak noise measurement is explained in more detail in section Noise Performance. (5) Long-term stability measurement procedure is explained in more detail in section Long–Term Stability. (6) Thermal hysteresis measurement procedure is explained in more detail in section Thermal Hysteresis. 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: REF3425 REF3430 REF3433 REF3440 REF3450 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Solder Heat Shift 8.2 Long-Term Stability 8.3 Thermal Hysteresis 8.4 Power Dissipation 8.5 Noise Performance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Supply Voltage 9.3.2 Low Temperature Drift 9.3.3 Load Current 9.4 Device Functional Modes 9.4.1 EN Pin 9.4.2 Negative Reference Voltage 10 Application and Implementation 10.1 Application Information 10.2 Typical Application: Basic Voltage Reference Connection 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Input and Output Capacitors 10.2.2.2 4-Wire Kelvin Connections 10.2.2.3 VIN Slew Rate Considerations 10.2.2.4 Shutdown/Enable Feature 10.2.3 Application Curves 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information
SBAS804F – SEPTEMBER 2017 – REVISED JUNE 2021
www.ti.com 7.5 Electrical Characteristics (continued)
At VIN = VOUT + VDO, COUT = 10 µF, CIN = 0.1 µF, IL = 0 mA, minimum and maximum specifications at TA = –40℃ to 125℃; Typical specifications at TA = 25℃ unless otherwise noted
PARAMETER TEST CONDITION MIN TYP MAX UNIT
Voltage reference in active mode (EN = 1) 1.6 VEN ENABLE pin voltage V Voltage reference in shutdown mode (EN = 0) 0.5 IL = 0 mA 50 100 VDO Dropout voltage mV IL = 10 mA 500 ENABLE pin leakage IEN V current EN = VIN = 12V 1 2 µA (1) Temperature drift is specified according to the box method. See Low Temperature Drift section for more details. (2) VDO for line regulation test is 50 mV. (3) VDO for load regulation test is 500 mV. (4) The peak-to-peak noise measurement is explained in more detail in section Noise Performance. (5) Long-term stability measurement procedure is explained in more detail in section Long–Term Stability. (6) Thermal hysteresis measurement procedure is explained in more detail in section Thermal Hysteresis. 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: REF3425 REF3430 REF3433 REF3440 REF3450 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Solder Heat Shift 8.2 Long-Term Stability 8.3 Thermal Hysteresis 8.4 Power Dissipation 8.5 Noise Performance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Supply Voltage 9.3.2 Low Temperature Drift 9.3.3 Load Current 9.4 Device Functional Modes 9.4.1 EN Pin 9.4.2 Negative Reference Voltage 10 Application and Implementation 10.1 Application Information 10.2 Typical Application: Basic Voltage Reference Connection 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Input and Output Capacitors 10.2.2.2 4-Wire Kelvin Connections 10.2.2.3 VIN Slew Rate Considerations 10.2.2.4 Shutdown/Enable Feature 10.2.3 Application Curves 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information
