Datasheet TLV9152 (Texas Instruments) - 2

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TLV9151, TL V9152, TLV9154
SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022
www.ti.com Table of Contents 1 Features
..1 7.4 Device Functional Modes..30
2 Applications
... 1
8 Application and Implementation
.. 31
3 Description
...1 8.1 Application Information... 31
4 Revision History
.. 2 8.2 Typical Applications.. 31
5 Pin Configuration and Functions
...4
9 Power Supply Recommendations
..33
6 Specifications
.. 9
10 Layout
...33 6.1 Absolute Maximum Ratings.. 9 10.1 Layout Guidelines... 33 6.2 ESD Ratings... 9 10.2 Layout Example.. 34 6.3 Recommended Operating Conditions...9
11 Device and Documentation Support
..35 6.4 Thermal Information for Single Channel... 9 11.1 Device Support..35 6.5 Thermal Information for Dual Channel..10 11.2 Documentation Support.. 35 6.6 Thermal Information for Quad Channel.. 10 11.3 Receiving Notification of Documentation Updates.. 35 6.7 Electrical Characteristics...11 11.4 Support Resources... 35 6.8 Typical Characteristics.. 15 11.5 Trademarks... 36
7 Detailed Description
..22 11.6 Electrostatic Discharge Caution.. 36 7.1 Overview... 22 11.7 Glossary.. 36 7.2 Functional Block Diagram... 22
12 Mechanical, Packaging, and Orderable
7.3 Feature Description...23
Information
.. 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (May 2021) to Revision E (January 2022) Page
• Updated industry standard packages in Features to match the packages available in Device Information section ... 1 • Added SOT-23-14 (DYY) package to Device Information ... 1 • Added SOT-23-14 (DYY) package and pin functions in Pin Configurations and Functions section... 4 • Removed WQFN-14 (RTE) package and pin functions in Pin Configurations and Functions section..4 • Removed WQFN-16 (RTE) package and pin functions in Pin Configurations and Functions section..4 • Corrected typo mislabeling the RUC package as having an "Exposed Thermal Pad" in Pin Configurations and Functions section..4 • Removed SOT-553 (DRL) package and pin functions from Pin Configurations and Functions section... 4 • Removed SOT-563 (DRL) package and pin functions from Pin Configurations and Functions section... 4 • Corrected typo in Recommended Operating Conditions which labeled VIH as amplifier enabled and VIL as amplifier disabled to correctly label VIH as amplifier disabled and VIL as amplifier enabled...9 • Added SOT-23-14 (DYY) package in Thermal Information for Quad Channel section...10 • Corrected typo mislabeling the RUC package as a "WQFN" package instead of as a "X2QFN" package in Thermal Information for Quad Channel section..10 • Removed "TLV9154S" from header of Thermal Information for Quad Channel section...10 • Maximum PSRR specification from VS = 4 V to 16 V changed from ±1 μV/V to ±1.6 μV/V..11 • Maximum PSRR specification from VS = 2.7 V to 16 V changed from ±5 μV/V to ±8.64 μV/V...11 • Minimum CMRR specification for VS = 16 V changed from 109dB to 99dB... 11 • Corrected typo in IQSD test conditions in Electrical Characteristics table from "SHDN = V–" to "SHDN = V– + 2 V".. 11 • Removed the overbar from the SHDN pin name in the note on toff and ton in the Electrical Characteristics section for consistency..11 • Updated Figure EMIRR Testing and Table TLV9151 EMIRR IN+ for Frequencies of Interest in EMI Rejection to match the increased performance from Figure EMIRR (Electromagnetic Interference Rejection Ratio) vs Frequency in Electrical Characteristics ..23 • Changed input resistor values in Equivalent Internal ESD Circuitry Relative to a Typical Circuit Application in Electrical Overstress section to more closely resemble device ... 27 • Removed WQFN (RTE) package from Packages With an Exposed Thermal Pad ..29 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TLV9151 TLV9152 TLV9154 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information for Single Channel 6.5 Thermal Information for Dual Channel 6.6 Thermal Information for Quad Channel 6.7 Electrical Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 EMI Rejection 7.3.2 Thermal Protection 7.3.3 Capacitive Load and Stability 7.3.4 Common-Mode Voltage Range 7.3.5 Phase Reversal Protection 7.3.6 Electrical Overstress 7.3.7 Overload Recovery 7.3.8 Typical Specifications and Distributions 7.3.9 Packages With an Exposed Thermal Pad 7.3.10 Shutdown 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Low-Side Current Measurement 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ (Free Software Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Receiving Notification of Documentation Updates 11.4 Support Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information