Datasheet REF3425-EP (Texas Instruments) - 4

REF3425-EP , REF3430-EP , REF3433-EP, REF3440-EP
SBAS942B – DECEMBER 2018 – REVISED APRIL 2019
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
IN VREF + 0.05 13 Input voltage V EN –0.3 IN + 0.3 Output voltage VREF –0.3 5.5 V Output short circuit current 20 mA Operating, T (2) j –55 150 Temperature °C Storage, Tstg –65 170 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) By design, the device is specified functional over the operating temperature of –55°C to 150°C.
7.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
IN Supply input voltage (I (1) L = 0 mA, TA = 25°C) VREF + VDO 12 V EN Enable voltage 0 IN V IL Output current –10 10 mA Tj Operating temperature –55 25 125 °C (1) Dropout voltage.
7.4 Thermal Information REF34xx-EP THERMAL METRIC(1) DBV (SOT-23) UNIT 6 PINS
RθJA Junction-to-ambient thermal resistance 185 °C/W RθJC(top) Junction-to-case (top) thermal resistance 156 °C/W RθJB Junction-to-board thermal resistance 29.6 °C/W ψJT Junction-to-top characterization parameter 33.8 °C/W ψJB Junction-to-board characterization parameter 29.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Documentation Feedback Copyright © 2018–2019, Texas Instruments Incorporated Product Folder Links: REF3425-EP REF3430-EP REF3433-EP REF3440-EP Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Solder Heat Shift 8.2 Long-Term Stability 8.3 Power Dissipation 8.4 Noise Performance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Supply Voltage 9.3.2 Low Temperature Drift 9.3.3 Load Current 9.4 Device Functional Modes 9.4.1  EN Pin 9.4.2 Negative Reference Voltage 10 Application and Implementation 10.1 Application Information 10.2 Typical Application: Basic Voltage Reference Connection 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Input and Output Capacitors 10.2.2.2 4-Wire Kelvin Connections 10.2.2.3 VIN Slew Rate Considerations 10.2.2.4 Shutdown/Enable Feature 10.2.3 Application Curves 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Related Links 13.3 Receiving Notification of Documentation Updates 13.4 Community Resources 13.5 Trademarks 13.6 Electrostatic Discharge Caution 13.7 Glossary 14 Mechanical, Packaging, and Orderable Information