Datasheet ATL432LI (Texas Instruments) - 4
Manufacturer | Texas Instruments |
Description | High-bandwidth, low-IQ programmable shunt regulator (pinout: RKA) |
Pages / Page | 40 / 4 — ATL431LI. ATL432LI. www.ti.com. 7 Specifications. 7.1 Absolute Maximum … |
File Format / Size | PDF / 1.4 Mb |
Document Language | English |
ATL431LI. ATL432LI. www.ti.com. 7 Specifications. 7.1 Absolute Maximum Ratings. MIN. MAX. UNIT. 7.2 ESD Ratings. VALUE
Text Version of Document
ATL431LI ATL432LI
SLVSDU6D – JULY 2017 – REVISED NOVEMBER 2019
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VKA Cathode Voltage(2) 37 V IKA Continuos Cathode Current Range –10 18 mA II(ref) Reference Input Current –5 10 mA TJ Operating Junction Temperature Range –40 150 C Tstg Storage Temperature Range –65 150 C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to ANODE, unless otherwise noted.
7.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001pins(1) ±2000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22- ±1000 VC101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Thermal Information ATL43xLI THERMAL METRIC(1) DBZ DQN UNIT 3 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 371.7 173.7 C/W RθJC(top) Junction-to-case (top) thermal resistance 145.9 185.5 C/W RθJB Junction-to-board thermal resistance 104.7 119.9 C/W ψJT Junction-to-top characterization parameter 23.9 13.1 C/W ψJB Juction-to-board characterization parameter 102.9 119.9 C/W RθJC(bottom) Juction-to-case (bottom) thermal resistance N/A 93.0 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.4 Recommended Operating Conditions
See (1)
MIN MAX UNIT
VKA Cathode Voltage VREF 36 V IKA Continuous Cathode Current Range 0.08 15 mA ATL43xLIxI –40 85 C TA Operating Free-Air Temperature ATL43xLIxQ –40 125 C (1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 4 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: ATL431LI ATL432LI Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Thermal Information 7.4 Recommended Operating Conditions 7.5 Electrical Characteristics 8 Typical Characteristics 9 Parameter Measurement Information 9.1 Temperature Coefficient 9.2 Dynamic Impedance 10 Detailed Description 10.1 Overview 10.2 Functional Block Diagram 10.3 Feature Description 10.4 Device Functional Modes 10.4.1 Open Loop (Comparator) 10.4.2 Closed Loop 11 Applications and Implementation 11.1 Application Information 11.2 Typical Applications 11.2.1 Comparator With Integrated Reference 11.2.1.1 Design Requirements 11.2.1.2 Detailed Design Procedure 11.2.1.3 Application Curve 11.2.2 Precision Constant Current Sink 11.2.2.1 Design Requirements 11.2.2.2 Detailed Design Procedure 11.2.3 Shunt Regulator/Reference 11.2.3.1 Design Requirements 11.2.3.2 Detailed Design Procedure 11.2.3.3 Application Curve 11.2.4 Isolated Flyback with Optocoupler 11.2.4.1 Design Requirements 11.3 System Examples 12 Power Supply Recommendations 13 Layout 13.1 Layout Guidelines 13.2 SOT23-3 Layout Example 13.3 X2SON (DQN) Layout Example 13.4 Thermal Considerations 14 Device and Documentation Support 14.1 Documentation Support 14.1.1 Device Nomenclature 14.1.2 Related Documentation 14.2 Related Links 14.3 Receiving Notification of Documentation Updates 14.4 Community Resources 14.5 Trademarks 14.6 Electrostatic Discharge Caution 14.7 Glossary 15 Mechanical, Packaging, and Orderable Information