Datasheet REF35 (Texas Instruments) - 4
| Manufacturer | Texas Instruments |
| Description | 650-nA quiescent current, 12-ppm/°C drift, ultra-low-power precision voltage reference |
| Pages / Page | 44 / 4 — REF35. www.ti.com. 6 Specifications 6.1 Absolute Maximum Ratings. MIN. … |
| File Format / Size | PDF / 2.2 Mb |
| Document Language | English |
REF35. www.ti.com. 6 Specifications 6.1 Absolute Maximum Ratings. MIN. MAX. UNIT. 6.2 ESD Ratings. VALUE
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REF35
SNAS809C – DECEMBER 2021 – REVISED SEPTEMBER 2024
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage IN –0.3 6.5 V Enable voltage EN –0.3 IN + 0.3 (2) V Output voltage VREF –0.3 IN + 0.3 (2) V Output short circuit current ISC 20 mA Operating temperature range TA –55 125 °C Storage temperature range Tstg –65 170 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) IN + 0.3V or 6.5V, whichever is lower
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins (2) ±750 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
IN Input voltage (1) V (2) OUT + VDO 6 V EN Enable voltage 0 IN V IL Output current –5 10 mA TA Operating temperature –40 25 125 °C (1) For VREF = 1.024V to 1.5V, minimum VIN = 1.7V (2) VDO = Dropout voltage
6.4 Thermal Information REF35 THERMAL METRIC
(1)
YBH (WCSP) DBV (SOT-23) UNIT 4 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 178.9 164.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.1 102.5 °C/W RθJB Junction-to-board thermal resistance 60.3 59.6 °C/W ΨJT Junction-to-top characterization parameter 0.5 44.0 °C/W ΨJB Junction-to-board characterization parameter 60.2 59.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: REF35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Electrical Characteristics YBH package 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Solder Heat Shift 7.2 Temperature Coefficient 7.3 Long-Term Stability 7.4 Thermal Hysteresis 7.5 Noise Performance 7.5.1 Low-Frequency (1/f) Noise 7.5.2 Broadband Noise 7.6 Power Dissipation 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Supply Voltage 8.3.2 EN Pin 8.3.3 NR Pin 8.4 Device Functional Modes 8.4.1 Basic Connections 8.4.2 Start-Up 8.4.3 Output Transient Behavior 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Negative Reference Voltage 9.2.2 Precision Power Supply and Reference 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Selection of Reference 9.2.2.2.2 Input and Output Capacitors 9.2.2.2.3 Selection of ADC 9.2.2.3 Application Curves 9.3 Power Supply Recommendations 9.4 Layout 9.4.1 Layout Guidelines 9.4.2 Layout Examples 10 Device and Documentation Support 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information
REF35
SNAS809C – DECEMBER 2021 – REVISED SEPTEMBER 2024
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage IN –0.3 6.5 V Enable voltage EN –0.3 IN + 0.3 (2) V Output voltage VREF –0.3 IN + 0.3 (2) V Output short circuit current ISC 20 mA Operating temperature range TA –55 125 °C Storage temperature range Tstg –65 170 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) IN + 0.3V or 6.5V, whichever is lower
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins (2) ±750 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
IN Input voltage (1) V (2) OUT + VDO 6 V EN Enable voltage 0 IN V IL Output current –5 10 mA TA Operating temperature –40 25 125 °C (1) For VREF = 1.024V to 1.5V, minimum VIN = 1.7V (2) VDO = Dropout voltage
6.4 Thermal Information REF35 THERMAL METRIC
(1)
YBH (WCSP) DBV (SOT-23) UNIT 4 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 178.9 164.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.1 102.5 °C/W RθJB Junction-to-board thermal resistance 60.3 59.6 °C/W ΨJT Junction-to-top characterization parameter 0.5 44.0 °C/W ΨJB Junction-to-board characterization parameter 60.2 59.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: REF35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Electrical Characteristics YBH package 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Solder Heat Shift 7.2 Temperature Coefficient 7.3 Long-Term Stability 7.4 Thermal Hysteresis 7.5 Noise Performance 7.5.1 Low-Frequency (1/f) Noise 7.5.2 Broadband Noise 7.6 Power Dissipation 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Supply Voltage 8.3.2 EN Pin 8.3.3 NR Pin 8.4 Device Functional Modes 8.4.1 Basic Connections 8.4.2 Start-Up 8.4.3 Output Transient Behavior 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Negative Reference Voltage 9.2.2 Precision Power Supply and Reference 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Selection of Reference 9.2.2.2.2 Input and Output Capacitors 9.2.2.2.3 Selection of ADC 9.2.2.3 Application Curves 9.3 Power Supply Recommendations 9.4 Layout 9.4.1 Layout Guidelines 9.4.2 Layout Examples 10 Device and Documentation Support 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information
