Datasheet REF35 (Texas Instruments) - 8
| Manufacturer | Texas Instruments |
| Description | 650-nA quiescent current, 12-ppm/°C drift, ultra-low-power precision voltage reference |
| Pages / Page | 44 / 8 — REF35. www.ti.com. 6.7 Typical Characteristics. Figure 6-1. Output … |
| File Format / Size | PDF / 2.2 Mb |
| Document Language | English |
REF35. www.ti.com. 6.7 Typical Characteristics. Figure 6-1. Output Voltage Drift vs Free-Air Temperature
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REF35
SNAS809C – DECEMBER 2021 – REVISED SEPTEMBER 2024
www.ti.com 6.7 Typical Characteristics
at TA = 25°C, VIN = VEN = VREF + 0.3V, IL = 0mA, CL = 10µF, CIN = 0.1µF (unless otherwise noted) 1000 50 VREF = 5V VREF = 2.5V VREF = 1.25V −40C to 85C −40C to 105C 750 40 ) 500 30 rift (ppm D 250 opulation (% 20 P 0 10 -250 -40 0 40 80 120 0 Te mperature (C) 0 1 2 3 4 5 6 7 8 9 10 11 SOT23 Package Te mperature Coefficient (ppm/C)
Figure 6-1. Output Voltage Drift vs Free-Air Temperature
SOT23 Package
Figure 6-2. Temperature Coefficient Distribution (VREF = 1.25V)
60 50 −40C to 85C −40C to 85C −40C to 105C −40C to 105C 48 40 ) 36 30 opulation (% 24 opulation (% 20 P P 12 10 0 0 0 1 2 3 4 5 6 7 8 9 10 11 0 1 2 3 4 5 6 7 8 9 10 11 Te mperature Coefficient (ppm/C) Te mperature Coefficient (ppm/C) SOT23 Package SOT23 Package
Figure 6-3. Temperature Coefficient Distribution (VREF = 2.5V) Figure 6-4. Temperature Coefficient Distribution (VREF = 5.0V)
500 5,000 VREF = 1.024V VREF = 1.8V VREF = 1.024V VREF = 1.8V VREF = 1.2V VREF = 1.2V 300 3,800 ) 100 ) 2,600 rift (ppm D -100 rift (ppm D 1,400 -300 200 -500 -40 0 40 80 120 -1,000 Te mperature (C) -40 -7 26 59 92 125 WCSP Package VREF < 2.5V (-40ºC to 85ºC) Te mperature (C)
Figure 6-5. Output Voltage Drift vs Free-Air Temperature
WCSP Package VREF < 2.5V (-40ºC to 125ºC)
Figure 6-6. Output Voltage Drift vs Free-Air Temperature
8 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: REF35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Electrical Characteristics YBH package 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Solder Heat Shift 7.2 Temperature Coefficient 7.3 Long-Term Stability 7.4 Thermal Hysteresis 7.5 Noise Performance 7.5.1 Low-Frequency (1/f) Noise 7.5.2 Broadband Noise 7.6 Power Dissipation 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Supply Voltage 8.3.2 EN Pin 8.3.3 NR Pin 8.4 Device Functional Modes 8.4.1 Basic Connections 8.4.2 Start-Up 8.4.3 Output Transient Behavior 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Negative Reference Voltage 9.2.2 Precision Power Supply and Reference 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Selection of Reference 9.2.2.2.2 Input and Output Capacitors 9.2.2.2.3 Selection of ADC 9.2.2.3 Application Curves 9.3 Power Supply Recommendations 9.4 Layout 9.4.1 Layout Guidelines 9.4.2 Layout Examples 10 Device and Documentation Support 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information
SNAS809C – DECEMBER 2021 – REVISED SEPTEMBER 2024
www.ti.com 6.7 Typical Characteristics
at TA = 25°C, VIN = VEN = VREF + 0.3V, IL = 0mA, CL = 10µF, CIN = 0.1µF (unless otherwise noted) 1000 50 VREF = 5V VREF = 2.5V VREF = 1.25V −40C to 85C −40C to 105C 750 40 ) 500 30 rift (ppm D 250 opulation (% 20 P 0 10 -250 -40 0 40 80 120 0 Te mperature (C) 0 1 2 3 4 5 6 7 8 9 10 11 SOT23 Package Te mperature Coefficient (ppm/C)
Figure 6-1. Output Voltage Drift vs Free-Air Temperature
SOT23 Package
Figure 6-2. Temperature Coefficient Distribution (VREF = 1.25V)
60 50 −40C to 85C −40C to 85C −40C to 105C −40C to 105C 48 40 ) 36 30 opulation (% 24 opulation (% 20 P P 12 10 0 0 0 1 2 3 4 5 6 7 8 9 10 11 0 1 2 3 4 5 6 7 8 9 10 11 Te mperature Coefficient (ppm/C) Te mperature Coefficient (ppm/C) SOT23 Package SOT23 Package
Figure 6-3. Temperature Coefficient Distribution (VREF = 2.5V) Figure 6-4. Temperature Coefficient Distribution (VREF = 5.0V)
500 5,000 VREF = 1.024V VREF = 1.8V VREF = 1.024V VREF = 1.8V VREF = 1.2V VREF = 1.2V 300 3,800 ) 100 ) 2,600 rift (ppm D -100 rift (ppm D 1,400 -300 200 -500 -40 0 40 80 120 -1,000 Te mperature (C) -40 -7 26 59 92 125 WCSP Package VREF < 2.5V (-40ºC to 85ºC) Te mperature (C)
Figure 6-5. Output Voltage Drift vs Free-Air Temperature
WCSP Package VREF < 2.5V (-40ºC to 125ºC)
Figure 6-6. Output Voltage Drift vs Free-Air Temperature
8 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: REF35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Electrical Characteristics YBH package 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Solder Heat Shift 7.2 Temperature Coefficient 7.3 Long-Term Stability 7.4 Thermal Hysteresis 7.5 Noise Performance 7.5.1 Low-Frequency (1/f) Noise 7.5.2 Broadband Noise 7.6 Power Dissipation 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Supply Voltage 8.3.2 EN Pin 8.3.3 NR Pin 8.4 Device Functional Modes 8.4.1 Basic Connections 8.4.2 Start-Up 8.4.3 Output Transient Behavior 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Negative Reference Voltage 9.2.2 Precision Power Supply and Reference 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Selection of Reference 9.2.2.2.2 Input and Output Capacitors 9.2.2.2.3 Selection of ADC 9.2.2.3 Application Curves 9.3 Power Supply Recommendations 9.4 Layout 9.4.1 Layout Guidelines 9.4.2 Layout Examples 10 Device and Documentation Support 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information
