Infineon Technologies has started the production of its BGTx0 chipsets for wireless backhaul communication systems. The transceiver family provides a complete radio frequency (RF) front-end for wireless communication in 57-64 GHz, 71-76 GHz, or 81-86 GHz millimeter wave bands. Paired with a baseband/modem, the system solution requires less space, offers improved reliability and lower cost for the critical wireless backhaul links needed in mobile base stations that support LTE/4G networks.
The lead customer Sub10 Systems is currently qualifying BGT70 and BGT80 E-band transceivers for an FDD (Frequency Division Duplex) system. Mark Stevens, Chief Technology Officer at Sub10 Systems, said: “We are delighted to be collaborating with Infineon on integration of the BGT70 and BGT80 chipset into our newly developed E-band transceiver. We expect high performance and high reliability at the same time, therefore we have chosen the best solution in the market.” The targeted system supports a data rate of more than 1 Gbit/s with link distances of about 2.5 kilometers.
Infineon’s BGTx0 family simplifies system design and production logistics by replacing more than 10 discrete devices by a single device. Due to their low power consumption the single-chip high-integration transceivers also help to reduce operating expenses in high data rate millimeter wave infrastructures.
Each mobile communication standard uses specific frequency bands to transport data. Current standards operate below 43 GHz, known as microwaves. As future standards – like latest LTE/4G – will require more capacity and higher data rates, public authorities have released V- and E-band using millimeter waves. Network operators are expected to invest heavily in small cell infrastructures in the years ahead in order to provide mobile phone users with high speed internet and full network coverage.
Availability
Engineering samples of BGTx0 transceivers are already available. Volume production is planned for spring 2014.
