The new Infineon's TO-Leadless package is optimized for high current applications, such as forklifts and light electric vehicles (LEV) as well as point of load (PoL) and telecom applications. This new package is a perfect solution for high-power applications that require the highest efficiency levels together with outstanding EMI and thermal behavior and space-saving footprints.
TO-Leadless has been designed for high currents up to 300 A. It also achieves lowest RDS(on) thanks to the latest OptiMOS™ silicon technology combined with reduced package resistance. This lowers the number of parallel MOSFETs needed in forklift applications and increases power density.
The 60-percent reduction in package size ensures very compact designs. TO-Leadless reduces footprint substantially – by 30 percent compared with the D²PAK 7-pin model. The 50-percent reduction in height offers a significant advantage in applications such as rack and blade servers, where compact designs are vital.
The low package parasitic inductances result in improved EMI behavior while the 50-percent increase in solder contact area improves reliability by eliminating electro migration at high current levels.
